MAZeT Unveils MTI08 8-channel Transimpedance Amplifier for Sensors
MAZeT GmbH is introducing a new 8-channel transimpedance amplifier for sensors that output currents. Each channel has eight amplification stages that can be individually set between 200 kOhm and 25.6 MOhm. The lowest photo current is 20 nA at a signal frequency of 19 kHz. The MTI08 provides an MUX after the output, a power-down mode and operates at a voltage of 3…5 V. The amplifier provides excellent channel synchronicity, high linearity as soon as low noise and can be supplied as a die or in a compact SSOP20 for sensor arrays/rows.
Apache Design Solutions to Take Part in DesignCon Sessions
Apache Design Solutions, the technology leader in power and noise integrity for chip, package, and system convergence, announced that they will be participating in several technical and business conference sessions at the upcoming DesignCon Conference held in Santa Clara, California. Apache’s key executives will be discussing the latest challenges and solutions in maintaining power, noise, and thermal integrity and driving convergence across IC, package, system, and SiP designers.
International Engineering Consortium Announces DesignCon IP Summit
The International Engineering Consortium’s (IEC) introduces the new IP Summit, a featured program fully integrated with the DesignCon conference and exhibition February 2-5 at the Santa Clara Convention Center. The IP Summit will address the role of semiconductor IP in electronic design through featured speakers, panels, tutorials, technical papers and exhibits.
TEK Microsystems Launches QuiXilica Tarvos-V5 VXS Digitizer Board
At the Real Time Embedded Computing Conference, TEK Microsystems, Incorporated, the leading supplier of VXS-based digitizers, has announced the new QuiXilica Tarvos-V5 VXS. This 6U ANSI/VITA 41 (VXS) compliant high-speed digitizer board combines high density FPGA processing with six 16-bit A/D input channels at 185 Msps (Megasamples per second) along with a coherent 16-bit D/A output channel.
Samsung Creates First 4Gb DDR3 DRAM Chip with 50 Nanometer Process
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that it has made a significant advancement in the push for higher volume memory chips by developing the world’s first four gigabit (Gb) DDR3 DRAM chip, using 50 nanometer (nm) process technology. With more and more data centers seeking a reduction in the number of servers they use, the development of low-power 4Gb DDR3 has become critical in reducing data center costs, improving server time management and increasing overall efficiency.
Virtutech to Take Part in DesignCon Multicore, Virtualization Panels
Virtutech, Inc. the leading provider of virtualized system development (VSD) solutions, announced that its principal technology specialist Ross Dickson will take part in panel discussions at DesignCon at the Santa Clara Conventions Center in Santa Clara, CA: “Multicore and Virtualization Key Enablers for Next-Generation Network Architecture,” from 1:30 to 4:30 PM PT, on Monday, February 2, at DesignCon 2009, and “Power Architecture Ecosystem Solution Offerings,” from 10:45 a.m. – 11:00 AM PDT, on Thursday, February 5.
NEXX Joins SEMATECH 3D Interconnect Program at UAlbany NanoCollege
SEMATECH, a global consortium of chip-makers, and NEXX Systems, Inc., a leading provider of process equipment for advanced wafer-level packaging applications, announced that NEXX Systems has become a member of SEMATECH’s 3D Interconnect Program located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
The Imaging Source Rolls Out New PCI-Express Frame Grabbers
The Imaging Source – an international manufacturer of industrial cameras, video converters and frame grabbers – announces a new series of PCI-Express frame grabbers. The models ship with a number of different video inputs. Some models are available for low profile PC cases. The Imaging Source frame grabbers are deployed for applications in which analog video signals (PAL, CCIR, NTSC, RS-170) need to be processed by a PC.
Dai Nippon Printing Slims Down Semiconductor Package with Lead Frame
Dai Nippon Printing Co., Ltd. (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this lead frame it has become possible to achieve a semiconductor package with a thickness of 0.15mm, or approximately 1/20th the thickness of existing general products, which is the slimmest molded package in the world to date.
Netrino Offers Tutorials at Embedded Systems Conference
TechInsights announced that Netrino, The Embedded Systems Expertssm and a leader in embedded systems training and engineering services, will hold three educational sessions at no-charge for engineers attending ESC Silicon Valley 2009 at the McEnery Convention Center, San Jose, California March 30 – April 3. Held in the “ESC Theater” on the main conference floor, the free Netrino sessions are open to all ESC 2009 attendees and complement TechInsights’ extensive paid educational program.
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