Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global design innovation, said that its Cadence® Encounter® Digital Implementation System for advanced RTL-to-GDSII chip design has enabled STMicroelectronics to equip their worldwide design teams with 65- and 40- nanometer production flows that provide industry leading performance and capacity for multi-million instance, high-performance SoC designs in the consumer, computer peripherals and wireless markets. In addition, STMicroelectronics’ and Cadence are collaborating on a next-generation 32nm design platform, based on STMicroelectronics’ state-of-the-art cell libraries, targeting low power, mixed-signal, and advanced system-in-package (SiP) design capabilities.
“We’ve been working closely with the Encounter product family and Cadence R&D for several years now, increasingly adopting Encounter digital implementation for STMicroelectronics’ most complex SoC products,” stated Philippe Magarshack, group vice president at the Technology R&D group of STMicroelectronics.
Encounter Digital Implementation System offers advancements in silicon virtual prototyping, die-size exploration and RTL and physical synthesis, providing improved predictability and optimization in early stages of the flow. In addition, the new system delivers end-to-end parallel processing, automated floorplan synthesis, innovative hierarchical abstraction technologies, end-to-end multi-mode, multi-corner (MMMC) optimization, variation-tolerant and low power clock tree and clock mesh synthesis, high-capacity placement and optimization, 32-nanometer routing, DFM-aware implementation and chip-and-package co-design.
“With the new performance and capacity improvements of Encounter Digital Implementation System we have significantly increased our usage, and are deploying Encounter for our 55-, 40-, and 32-nanometer SoCs,” said Thierry Bauchon, R&D Director for STMicroelectronics’ Home Entertainment Group.
“Cadence Encounter Digital Implementation System leads the way in performance, capacity, and breadth of solution for today’s complex, high-performance, low power, mixed-signal, and advanced node designs,” said Chi-Ping Hsu, senior vice president of Research and Development for the Implementation Products Group at Cadence. “Working in collaboration with world-class design companies such as STMicroelectronics, we’ve broken new ground in the digital design arena and delivered significant advantages to our users in QoS (Quality of Silicon), time-to-market, and overall risk reduction.”
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.
Cadence and Encounter are registered trademarks and the Cadence logo is a trademark of Cadence Design Systems, Inc. in the United States and other countries.