UMC Validates High-k/Metal-Gate Process Solution
UMC (NYSE:UMC)(TSE:2303), a leading global semiconductor foundry, announced a significant milestone for its high-k/metal-gate (HK/MG) technology with validation of the process through 45nm SRAM product yield. This achievement is a first key-step in demonstrating technology performance and process reliability for HK/MG technology, which will be used for UMC’s next generation 32/28nm process.
Si2 Unveils Power-Aware Design Flow, Low Power Design Documents
Silicon Integration Initiative (Si2) has released two documents on Power Aware Design Flows and Low Power Design Techniques developed by its Low Power Coalition (LPC). Both documents are available to the industry on the Si2 web site links as noted below. The first document, “Si2 Power Aware Design Flows,” outlines a best practices approach adopted by much of the industry regarding Power Aware Design Flows and the points in the flow for power closure decisions. This information provides a description of the current state of the art in ESL algorithms and system models, RTL design and IP integration, as well as physical implementation and synthesis in regards to power-aware design flows.
USPTO Awards Patent to Merrimac fro Multi-Mix Microtechnology
Merrimac Industries, Inc. (AMEX: MRM), a leader in the design and manufacture of RF Microwave components, assemblies and micro-multifunction modules (MMFM®), announced that it has been granted a patent for its Multi-Mix® Microtechnology from the United States Patent and Trademark Office entitled “Coupler Resource Module”. This patented technology enables Merrimac to produce, highly integrated, complex RF modules, with mixtures of active and passive technology in very small, rugged form factors. The flexibility of this technology allows it to be used for a wide range of components, such as amplifiers, frequency control products, passive microwave components, and integrated subsystems.
Texas Instruments Introduces bq2407x Lithium-ion Battery Chargers
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced four 28-V, 1.5-A linear charge management ICs with integrated FETs aimed at smart phones and other portable electronics. The bq2407x family of lithium-ion (Li-Ion) battery chargers allows an end-equipment to be powered directly from an external power source, even if the unit’s battery pack is defective, fully discharged or absent.
Creative Chips Selects Synopsys Galaxy Custom Designer
Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design and manufacturing, announced that Creative Chips has adopted Synopsys’ Galaxy Custom Designer[tm] custom implementation solution. As a designer of systems for the automotive and consumer markets, Creative Chips needs a modern-era solution that unifies cell-based and custom design. Custom Designer provides a comprehensive digital and analog design flow that helped enable Creative Chips to implement complex product designs and meet critical time-to-market, cost, and quality constraints.
American Portwell Debuts NAR-5650 1U Communication Appliance Platform
American Portwell Technology, Inc., a world-leading innovator in the industry of Communication/Network Security Appliances, and a member of the Intel® Embedded and Communications Alliance, has expanded its high-performance 1U communication appliance platform to make it even more cost effective with the introduction of the new NAR-5650. By combining the latest Intel 3210 Chipset with the 45/65nm dual core/quad core Xeon® 3000 series and Core(tm) 2 Duo/Core 2 Quad processors in the LGA775 package, the new NAR-5650 optimizes computer power and energy efficiency to provide the perfect choice for software providers who need solutions that can support up to 16 GbE ports in a 1U rackmount appliance. Portwell’s NAR-5650 integrates greater computing performance reliability and manageability, improved power efficiency, higher throughput, faster memory and I/O bandwidth, and faster data movement into a single sleek unit that measures a mere 443 (W) x 457.2 (D) x 44 (H) mm / 17.4″ (W) x 18″ (D) x 1.73″ (H).
Leadis Rolls Out TapTouch Solution for Capacitive Touch Applications
Leadis Technology, Inc. (Nasdaq: LDIS), a provider of best-in-class semiconductor solutions for display, power management, touch and audio applications, announced a technological innovation that lowers the cost of capacitive touch implementation in high button count applications. Leadis’ new TapTouch[tm] technology supports up to 56 independent touch zones with a single 15-channel integrated circuit, enabling the integration of large numbers of capacitive touch buttons while keeping system cost and power consumption to a minimum.
Intel, Micron Start Mass Production of 34nm MLC NAND Flash
Intel Corporation and Micron Technology Inc. (NYSE:MU) announced mass production of their jointly developed 34nm, 32 gigabit multi-level cell (MLC) NAND flash memory device. Developed and manufactured by the companies’ NAND flash joint venture, IM Flash Technologies (IMFT), the process technology is the most advanced process available on the market and enables the industry’s only monolithic 32 Gb NAND chip that fits into a standard 48-lead thin small-outline package (TSOP). The companies are ahead of schedule with 34nm NAND production, expecting their Lehi facility to have transitioned more than 50 percent of its capacity to 34nm by year’s end.
Agilent Unveils Test Solution for SuperSpeed USB 3.0 Devices
Agilent Technologies Inc. (NYSE:A) announced a comprehensive solution for testing SuperSpeed USB 3.0 devices to ensure compliance with the newly published standards. At the first USB 3.0 Developers Conference in San Jose, Calif., Agilent demonstrated its new USB 3.0 transmitter and USB 3.0 receiver compliance test solutions. This demonstration included the industry’s first USB 3.0 signal quality test fixture. The complete solution enables engineers to quickly and accurately test their USB 3.0 designs.
Cypress Offers Webinar on Designing Reliable Embedded Wireless System
Cypress Semiconductor Corp. (NYSE:CY) announced a free, online seminar that examines the challenges of designing a reliable embedded wireless system and presents a new solution to simplify the design process. The 60-minute webcast entitled “Reliable Wireless Sense and Control Made Easy” will be presented in conjunction with EDN.com on Wednesday, December 3 at 9:00 a.m. PST.
« Newer Posts || Older Posts »
If you are familiar with RSS feeds, you can also sign up for our free news feed. Our RSS feed is updated in real-time while our newsletter is updated daily.
