Merrimac Industries, Inc. (AMEX: MRM), a leader in the design and manufacture of RF Microwave components, assemblies and micro-multifunction modules (MMFM®), announced that it has been granted a patent for its Multi-Mix® Microtechnology from the United States Patent and Trademark Office entitled “Coupler Resource Module”. This patented technology enables Merrimac to produce, highly integrated, complex RF modules, with mixtures of active and passive technology in very small, rugged form factors. The flexibility of this technology allows it to be used for a wide range of components, such as amplifiers, frequency control products, passive microwave components, and integrated subsystems.
Multi-Mix® is a proven enabling technology for microwave multilayer integrated circuits and System In A Package® (SIP®) integrated modules. Merrimac’s proprietary process for constructing RF components and integrated modules on fluoropolymer composite substrates utilizes a unique method of manufacture whereby both passive and active devices are incorporated into a homogeneous multilayer dielectric medium.
Chairman and CEO Mason N. Carter noted, “This new Multi-Mix® patent is another positive step in our mission to keep Merrimac positioned as an industry leader in the design and manufacture of highly integrated RF/Microwave Components, Modules and Subsystems.”
Merrimac Industries, Inc. is a leader in the design and manufacture of RF Microwave signal processing components, subsystem assemblies, and Multi-Mix® micro-multifunction modules (MMFM®), for the worldwide Defense, Satellite Communications (Satcom), Commercial Wireless and Homeland Security market segments. Merrimac is focused on providing Total Integrated Packaging Solutions® with Multi-Mix® Microtechnology, a leading edge competency providing value to our customers through miniaturization and integration. Multi-Mix® MMFM® provides a patented and novel packaging technology that employs a platform modular architecture strategy that incorporates embedded semiconductor devices, MMICs, resistors, passive circuit elements and plated- through via holes to form a three-dimensional integrated module used in High Power, High Frequency and High Performance mission-critical applications. Merrimac Industries facilities are registered under ISO 9001:2000, an internationally developed set of quality criteria for manufacturing operations. Merrimac Industries, Inc. has facilities located in West Caldwell, NJ and San Jose, Costa Rica and has approximately 210 co-workers dedicated to the design and manufacture of signal processing components, gold plating of high- frequency microstrip and bonded stripline Teflon (PTFE) circuits and subsystems providing Total Integrated Packaging Solutions® for wireless applications. Merrimac (MRM) is listed on the American Stock Exchange. Multi- Mix®, Multi-Mix PICO®, MMFM®, System In A Package®, SIP® and Total Integrated Packaging Solutions® are registered trademarks of Merrimac Industries, Inc.