Open Core Protocol International Partnership (OCP-IP), an independent non-profit semiconductor industry consortium, and Sonics, Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect[tm] solutions, announce the addition of an enhanced OCP protocol checker to the CoreCreator[tm] II verification tool. The tool enables users to quickly and efficiently identify OCP protocol violations at each socket.
The OCP checker is the premier fourth-generation solution for validating protocol compliance of master and slave devices communicating utilizing OCP. It is based on SystemVerilog assertions (SVA) and can be used with all major logic simulators. It supports the complete set of protocol compliance checks defined in the OCP specification and spans the full range of OCP socket configuration options. The OCP checker can also generate trace files in the standard “.ocp” format for post-processing.
In addition to the OCP checker, CoreCreator II now includes OCP disassembler (ocpdis2) and OCP performance analyzer (ocpperf2) tools. These tools allow designers to validate their OCP socket interfaces and maximize performance.
CoreCreator II features verification IP and command-line based tools for validating OCP implementations, reducing design time and risk, and enabling rapid time to market. It allows users to verify, debug, and analyze OCP-based IP cores and systems.
“The addition of the enhanced checker, along with the previously announced DesignWare to CoreCreator II, shows the tremendous cooperation and collaboration among our members,” said Ian Mackintosh president of OCP-IP. “CoreCreator II, along with the rest of OCP-IP’s vast infrastructure, gives our members access to the best-in-class solutions eliminating the need to internally design, document, train and evolve a proprietary standard and accompanying support tools, freeing up critical resources for the real design work, and providing enormous cost savings.”
“The contribution of Sonics’ SOLV is aligned with Synopsys’ earlier donation of the DesignWare Verification IP for OCP to the OCP-IP CoreCreator II toolset,” said John Koeter, vice president of marketing for the Solutions Group at Synopsys. “Using SOLV has provided an additional method to test that the DesignWare Verification IP for OCP complies with the OCP-IP standard, and ensures that SOLV is fully interoperable with the DesignWare Verification IP for OCP. By making SOLV available to the growing OCP-IP community, many more designers will be able to experience its benefits.”
“As a founding member of OCP-IP, Sonics remains committed to the organization and its mission to proliferate a common standard for IP core sockets that facilitate ‘plug and play’ SoC design,” said Sonics CTO Drew Wingard. “The SOLV verification package addresses a universal need of core designers, to continuously improve the quality and performance of their designs.”
Members can now request copies of CoreCreator II as part of the benefits of their membership agreement by visiting the OCP-IP website.
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP’s Governing Steering Committee participants include: Nokia [NYSE: NOK], Sonics Inc., Synopsys [SNPS], Texas Instruments [NYSE: TXN], and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs.
Sonics Inc. supplies critical semiconductor intellectual property for SoCs. Its customers see the benefits of high design predictability and increased design efficiency. Sonics solutions address the growing complexity found in consumer products with voice, data and video features. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba leverage Sonics’ technology in leading products in the wireless, digital multimedia and communications markets.
®Sonics Inc., the company’s logo and SMART Interconnect are registered trademarks of Sonics Inc.