siXis, Inc., a semiconductor company focused on commercializing its Silicon Circuit Board (SiCB) technology, introduced its first product, the SX1000 Reconfigurable Computing Platform. The SX1000, based on field-programmable gate array (FPGA) technology, provides desktop supercomputing power and is modular and extremely scalable. Utilizing SiCB technology, the SX1000 is significantly smaller, provides higher performance, uses less power and generates less heat than any other high performance reconfigurable computing system available today.
“The SX1000 takes advantage of all the benefits of siXis’ SiCB technology,” said John Goehrke, President and CEO of siXis. “Our innovative silicon-connecting-silicon approach promises to revolutionize the future of computing and ultimately change the face of electronics over the next decade.”
The company’s SiCB technology integrates packaged and unpackaged semiconductor devices on large-area silicon substrates, replacing the current method of putting packaged die onto a conventional printed circuit board. Previously, silicon circuit boards were limited to approximately one square inch while demonstrating reliability problems at larger sizes. With siXis’ technology, reliable silicon circuit boards up to 24 square inches are now possible.
Products that use siXis SiCB technology will have a significantly smaller form factor (a ten to one reduction in area and 100 to one reduction in volume), exhibit higher performance, be scalable, weigh less, use less power, have higher reliability and be less expensive than products available today.
The SX1000 Reconfigurable Computing Platform will be available in the second half of 2009. Customers who want to begin immediate software development on the platform can contact siXis for its architecturally equivalent conventional printed circuit board based SX1000 Development System. The SX1000-DS is currently available with a six to eight week delivery lead time.
siXis will be exhibiting at SC08, an international conference for high performance computing, networking, storage and analysis in Austin, Texas from November 15-21. The company will be demonstrating the SX1000-DS at the conference in booth #2049.
About siXis, Inc.
siXis has created the next generation of electronic component integration through its Silicon Circuit Board (SiCB) technology effectively paving the way to replace traditional fiberglass printed circuit boards (PCBs). siXis technology enables the future of high performance electronics for a diverse group of markets including the military, medical imaging, networking, geosciences, computing, biosciences, financial services and consumer electronic. The company, created with technology developed at RTI International, received CED’s 2008 Entrepreneurial Excellence Spin-Out of the Year Award.