TDK Corporation announced that it developed and began mass-producing in September a multilayer bandpass filter for 2.4 GHz wireless LAN and Bluetooth use that achieves same low-loss and high-attenuation characteristics of earlier products despite its 1608 size and 0.55 mm thickness, making it about 40% smaller in volume.
As mobile communications terminals such as mobile phones have been made smaller and lighter while functioning at higher speeds and higher frequencies, there have been rising demands in recent years for the high-performance electronic components used in such devices to become more compact and slimmer. Equipping such devices with short-range wireless communications systems such as wireless LAN and Bluetooth has made possible high-speed, high-volume data communications, and use of such devices is expected to grow substantially in the future.
Bandpass filters are a type of electronic component that isolate the necessary electrical signal by allowing only certain frequencies to pass through. The new filters adopt an innovative design with a compact resonator and a low-loss structure for the resonator connector to achieve the industry’s first* low-loss, high-attenuation filter with the same properties as TDK’s earlier 2012-size filter in a 1608-size component with 40% less volume. This filter will contribute to the miniaturization of mobile devices as well as space and power savings.
* As of September 2008, according to TDK investigations.
- High-Q inter-digital resonator and a resonator connector with a low-loss structure
- Volume is 40% smaller than earlier products but the characteristics are the same
- Compact size saves resources and electric power
Production and Sales Plan
- Production location: Japan
- Production capacity: 10 million units/month (initially)
TDK Corporation (TSE: 6762; NYSE: TDK) is a leading global electronics company based in Japan. It was established in 1935 to commercialize “ferrite,” a key material in electronics and magnetics. TDK’s current product line includes ferrite materials, electronic components and ICs, wireless computer networking products, magnetic heads for HDD, digital recording hardware and advanced digital recording media.