Wipro Technologies Becomes Member of Power Forward Initiative

Power Forward Initiative (PFI) announced that Wipro Technologies has recently joined the initiative and is offering Common Power Format (CPF)-enabled low-power design capabilities to its design services customers worldwide. The PFI membership has now grown to over 30 companies around the world, representing a broad spectrum of semiconductor, IP, EDA, ASIC, design services and manufacturing providers.

Wipro has adopted the Cadence® Design Systems, Inc. (NASDAQ: CDNS) Low-Power Solution, which integrates leading-edge design, verification, and implementation technology with the widely deployed CPF standard to deliver an end-to-end low-power design solution to IC engineers. By preserving low-power design intent throughout the design process, the solution eliminates laborious manual work, reduces power-related chip failure, and provides power predictability early in the design process, enabling sharing and reuse of low-power intelligence throughout the design process.

Wipro is the largest independent provider of R&D services in the world. Using an “Extended Engineering” model for leveraging R&D investment and accessing new knowledge and experience across the globe, people and technical infrastructure, Wipro enables firms to introduce new products rapidly. Using the Cadence Low-Power Solution will enable Wipro’s delivery of more power efficient chip designs.

“Reducing the energy footprint of electronic products has become an important consideration for ICs and subsystems targeting a wide range of both handheld and wired products,” said Vasudevan Aghoramoorthy, vice president, Semiconductor & System Solutions, Wipro Technologies. “Cadence’s commitment to driving industry-wide solutions in low power design is in direct alignment with Wipro’s own low power design Green initiatives. We are pleased to join Cadence and other industry leaders in this important effort.”

“The demand for low power design is growing rapidly in all geographies driven by business and environmental considerations,” said Pankaj Mayor, group director of Business Enablement at Cadence Design Systems, Inc. “By joining the Power Forward Initiative, Wipro is affirming their commitment to collaborate with the industry to support customers’ mandates to reduce energy consumption.”

About Power Forward Initiative
The Power Forward Initiative, which has more than 30 member companies, is an industry initiative sponsored by Cadence Design Systems and has the goal of enabling the design and production of more power-efficient electronic devices. The initiative includes companies representing a broad cross section of the design chain including system, semiconductor, foundry, IP, EDA, ASIC and design services companies. CPF was contributed by Cadence to the Si2 Low Power Coalition in December 2006; CPF is now the most widely deployed low-power intent standard in the industry and available from Si2. The Initiative has also published A Practical Guide to Low-Power Design – User experience with CPF which is aimed at educating the broad design marketplace in utilizing advanced low-power design techniques.

About Wipro
Wipro (NYSE:WIT) is a $4 bn global provider of IT Services, Outsourced R&D, Infrastructure Outsourcing, Business Process Services, and Business Consulting. With 25 years in the global delivery of technology services, Wipro is the world’s largest third-party provider of R&D services and the world’s first PCMM and CMMi level company. Rated by industry analysts as a leader in global package implementation projects, CRM services, and Infrastructure Management among offshore firms, Wipro has won global recognition and awards for innovation and outsourcing excellence. Wipro Technologies’ 2100+ Semiconductor / System engineers and 16,000+ embedded software engineers make it the World’s largest independent R&D service provider. Combined with best-in-class methodology, EagleWision[TM] Wipro has one of the best first-pass-success rate for 300+ silicon and 200+ system designs delivered over the last 2 years. These include engagements in 65nm, 90nm and 0.13µ for telecommunication, storage, avionics, consumer electronics, medical electronics, automotive and industrial control domains.

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