Archive for September 2008

Birdstep Raima Database Manager Supports Micrium uC/OS-II RTOS

Posted by EDA Geek News Staff in Database, RTOS on Tuesday, September 30, 2008

Birdstep Technology (OSE: BIRD) announced that it has entered into a cross-marketing agreement with rapidly growing embedded system components developer Micriµm. As part of the agreement, Birdstep Technology has added µC/OS-II with µC/FS as the newest platform supported by the Raima Database Manager (RDM) family of products.

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Interface Masters Rolls Out Niagara 130x Embedded Switch Family

Posted by EDA Geek News Staff in Networking on Tuesday, September 30, 2008

Interface Masters Technologies, an industry leader and innovator in networking solutions, introduced a new family of Embedded Switches (ES) products targeted to networking appliances, servers, server blades and embedded computing applications. The Niagara 130x Family is a fully featured embedded Ethernet switch that provides Layer2/Layer3 Gigabit Ethernet and is ready to be integrated into servers by connecting via a serial or Ethernet connection, which enables quick time to market for complex networking appliances. The family is based on the Vitesse SparX-G24 and provides no blocking, wire-speed Gigabit performance on all ports, using an internal 46-Gbps frame bus. The devices are optimized for SMB and SOHO for unmanaged, as well as managed, applications. Due to the internal memory buffers, which are sufficient in size to absorb substantial bursts, no external memory is required.

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ASML Reveals Roadmap at Symposium on Extreme Ultraviolet Lithography

Posted by EDA Geek News Staff in Equipment on Tuesday, September 30, 2008

ASML Holding NV (ASML) presents at the 2008 International Symposium on Extreme Ultraviolet Lithography (EUV) on recent achievements in its EUV lithography program and unveils a production system roadmap that supports cost-effective chip manufacturing to at least 11 nanometers (nm). The NXE series of lithography machines will be built on an evolved TWINSCAN[tm] platform. Design of the first production system is complete, the supply chain is fully engaged and system manufacturing has started. ASML currently has orders for five of these systems from Memory and Logic customers on three continents.

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Digi ConnectCore 9P 9215 Supports Microsoft .NET Micro Framework v2.5

Posted by EDA Geek News Staff in Networking on Tuesday, September 30, 2008

Digi International (NASDAQ:DGII) introduced Microsoft .NET Micro Framework v2.5 support for the ConnectCore 9P 9215, a versatile ARM9-based Ethernet networking core module. The .NET Micro Framework extends the reach of Microsoft's embedded solutions to integrated device platforms with smaller memory footprints. The ConnectCore 9P 9215 features a rich set of interfaces expanding the .NET Micro Framework's capabilities into new applications such as networked sensor monitoring, data acquisition and machine control.

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Virage Logic, TSMC Expand Process Optimized IP Agreement

Posted by EDA Geek News Staff in IP Cores on Tuesday, September 30, 2008

Virage Logic Corporation (NASDAQ:VIRL), the semiconductor industry's trusted IP partner, and TSMC, the world's largest dedicated semiconductor foundry, have extended their agreement to provide end-market process optimized intellectual property (IP) for System-on-Chip (SoC) designs for both mainstream and advanced process technologies. Under the expanded agreement, Virage Logic will develop physical IP, such as embedded memories and logic libraries, for both new and optimized processes ranging from 180-nanometer (nm) to 40nm. The collaboration enables Virage Logic and TSMC to more quickly meet their customers' shifting and stringent application-specific requirements.

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OCP-IP Releases Industry Organizations Chart

Posted by EDA Geek News Staff in Other on Tuesday, September 30, 2008

Open Core Protocol International Partnership (OCP-IP) announced the release of an Industry Organizations Chart. The chart enables viewers to quickly and easily understand the large and growing scope of benefits, activities and deliverables available from multiple industry bodies throughout the EDA, Semiconductor and IP landscape from a single source.

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