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Archive for August 2008

DFI-ITOX Achieves Associate Status in Intel Embedded Alliance

Posted by Ken Cheung in Boards, Busses on Thursday, August 28, 2008

DFI Inc., a leading embedded product solution supplier, announced that DFI-ITOX has been elevated from Affiliate to Associate status in the Intel® Embedded and Communications Alliance (Intel® ECA), a community of communications and embedded developer solution providers. DFI-ITOX achieved this distinction by consistently demonstrating its commitment to innovation and through its ability to meet customer demands for the highest-quality boards ranging in form-factors from Mini-ITX through ATX.

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Crossware ARM Development Suite Supports Atmel AT91SAM9263 MCU

Posted by Ken Cheung in EDA Tools on Thursday, August 28, 2008

Crossware, a leading embedded software tools developer, has enhanced its ARM® Development Suite by adding support for the graphics peripherals of the Atmel AT91SAM9263 ARM-based microcontroller. The enhancements will allow developers using this chip to get programs up and running even more quickly and thereby speed up the whole development process.

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CRFS Debugs RFeye Spectrum Monitoring System with XJTAG Boundary Scan

Posted by Ken Cheung in Test Solution on Thursday, August 28, 2008

CRFS (Cambridge Radio Frequency Services), a developer and manufacturer of innovative real-time spectral analysis tools, has selected the XJTAG boundary scan development system to debug, test and programme its RFeye[tm] real-time spectrum monitoring system. The XJTAG development system is being used by engineers at CRFS’s design facility in Cambridge, England, to speed up debug and test of ball grid array (BGA) populated printed circuits boards which form part of the RFeye system. XJTAG is also being used to create test harnesses to improve coverage during production testing at CRFS’s contract manufacturing partner’s site.

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Chipright, CreVinn, Verilab Adopt VMM Verification Methodology

Posted by Ken Cheung in EDA Tools on Wednesday, August 27, 2008

Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design and manufacturing, announced that Chipright, CreVinn and Verilab, three leading European chip design and verification consulting companies, have standardized on the proven VMM verification methodology to streamline verification and speed time-to-market for their customers. The VMM methodology, originally defined in the Verification Methodology Manual for SystemVerilog, allows consulting firms to quickly deploy modular, scalable and reusable verification environments while enabling them to access the growing installed base of VMM users and availability of VMM-enabled verification components. This, in turn, accelerates their delivery of SystemVerilog-based verification services for the most complex chip designs. The VMM base class library and application source code are available for free download.

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Sierra Circuits Acquires Printed Circuit Board Business from EMRISE

Posted by Ken Cheung in Boards, Busses on Wednesday, August 27, 2008

EMRISE CORPORATION (NYSE Arca:ERI), a multi-national manufacturer of defense and aerospace electronic devices and communications equipment, announced that it has sold the assets of its printed circuit board (PCB) business, EMRISE Circuit Division (ECD), in Monrovia, CA., to Sierra Circuits, Inc. (Sierra), a leading provider of quick-turn printed circuit boards located in Sunnyvale, CA.

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MontaVista Linux Meets CGL 4 for Linux on Cavium OCTEON Processors

Posted by Ken Cheung in RTOS on Wednesday, August 27, 2008

MontaVista® Software, Inc., the leader in embedded Linux® commercialization, announced that its Carrier Grade Edition (CGE) 5.0 is the first Linux distribution to register compliance with the Linux Foundation’s Carrier Grade Linux (CGL) 4.0 specification for the Cavium Networks (NASDAQ: CAVM) OCTEON[tm] Multicore MIPS64® family of processors. MontaVista Linux brings commercial-grade quality, integration, hardware enablement, expert support, and the resources of the MontaVista development community to embedded developers using Cavium OCTEON multicore processors.

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RadiSys Debuts Procelerant COM Express Modules with Intel Core 2 Duo

Posted by Ken Cheung in Boards, Busses on Wednesday, August 27, 2008

RadiSys® Corporation (NASDAQ:RSYS), a leading global provider of advanced embedded solutions, announced the availability of four new Procelerant[tm] COM Express modules all powered by Intel Core 2 Duo Processor technology and the Mobile Intel® GS45/GM45 Express chipsets. The new compact 95mm x 125mm computer-on-modules (COMs) are ideal for developers designing portable devices for such applications as medical and machine imaging that mandate processing performance, large file transfers, high-throughput communications, yet low power.

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Design and Verification Conference Issues Call for Papers

Posted by Ken Cheung in Events, Training on Wednesday, August 27, 2008

The 2009 Design and Verification Conference (DVCon), sponsored by Accellera, is now accepting paper, panel and tutorial submissions. Proposals that reflect real experiences using hardware design and verification languages, advanced tools and methodologies are encouraged. Paper and panel proposals are due September 19, 2008.

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Kontron Rolls Out ETXexpress-PC COM Express Computer-on-Module

Posted by Ken Cheung in Boards, Busses on Wednesday, August 27, 2008

Equipped with space- and energy-saving 45nm high-end processors, the new Kontron ETXexpress®-PC COM Express[tm] Computer-on-Module sets new performance-per-watt standards for embedded applications with high demands on data processing and/or multi-media conversion and output. Based around the also recently introduced high performance and low-power 45nm Intel® Core[tm] 2 Duo processor SP9300 and Intel® GS45 chipset, this very robust COM Express[tm] module excels over the previous 65nm dual core processor offerings by enabling faster core speeds (up to 2.26 GHz), more L2 cache (6MB) and a faster FSB (1066 MHz), but without a comparable increase in energy consumption.

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ZTE Selects Tundra PCI Express Product for Platform Graphics Card

Posted by Ken Cheung in Components on Wednesday, August 27, 2008

Tundra Semiconductor Corporation (TSX:TUN), a leader in System Interconnect, has been selected by ZTE Corporation, a leading global provider of telecommunications equipment and network solutions, to supply Tundra’s high performance PCI Express® product for ZTE’s Next Generation Platform System Graphics Card. ZTE selected Tundra’s high performance semiconductor to improve overall performance on its new Graphics Card. Tundra’s high performance semiconductor has typical power consumption of 1.3W, and incorporates power management to minimize power consumption during operation. In addition, the Tundra’s PCI Express product offers the flexibility, high performance, small footprint, low power consumption and drop-in compatibility that ZTE required for its new design.

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