GE Fanuc Intelligent Platforms, a unit of GE Enterprise Solutions, announced the Telum[tm] ASLP11 high performance processor AMC module. With up to 4 GBytes of ECC memory and currently featuring an Intel® Core[tm]2 Duo L7400 1.5GHz CPU (which will be regularly upgraded to take advantage of new processors from Intel), the ASLP11 is a single width, full- or mid-sized AMC processor board and is designed for distributed ATCA/MicroTCA processing applications such as wireless base stations, voice over packet, test and measurement, server blades and other enterprise-wide computing.
“Increasing numbers of customers are drawn to the inherent advantages of the AdvancedTCA and MicroTCA architectures, so the types of applications for which ATCA and MicroTCA are being chosen are becoming more demanding,” said Wayne McGee, Global Director of Commercial SBC and Server Product Line Management at GE Fanuc Intelligent Platforms. “The ASLP11 delivers the processing power, memory capacity, functionality and reliability that these applications need, as well as providing a straightforward upgrade path for our ASLP10 customers.”
Of special note is that the onboard x8 PCI Express controller and associated FCLKA fabric clock may be configured as either the root controller for a subtending PCI Express subnet or as an end node (target) on a PCI Express subnet. Defined by the host system during power up, this provides customers with superior flexibility and enhanced price/performance as it allows the host system to deploy distributed processing resources to support more sophisticated network applications.
Designed to be more reliable through the use of solder to attach all components to the board – enhancing its resistance to shock and vibration – the ASLP11 is optionally available in an extended temperature variant (-40° C to +55° C) to allow deployment in, for example, exterior locations. The ASLP11 also features an on-board 2 GBytes NAND Flash module which may be optionally upgraded for applications requiring greater memory capacity.
Two Gigabit Ethernet ports and two SATA ports are provided, as are watchdog and temperature sensors, with USB 2.0 ports and a COM serial port optionally available. Supported operating systems include standard distribution Linux® and Carrier Grade Linux.
The Module Management Controller (MMC) on the ASLP11 supports the Intelligent Platform Management Interface (IPMI) v2.0 architecture as defined in the AMC.0 specification and is responsible for power sequencing, hot swap and overall module management. The MMC allows independent platform management between all AMC modules, carrier, power supplies, fans and other accessories in a system. This feature may be used for autonomous monitoring, logging and recovery control functions.
Linux is the registered trademark of Linus Torvalds. Intel is a registered trademark, and Core is a trademark, of Intel Corporation.
About GE Fanuc Intelligent Platforms
GE Fanuc Intelligent Platforms, a joint venture between General Electric (NYSE: GE) and FANUC LTD of Japan, is a high-performance technology company and a global provider of hardware, software, services, expertise and experience in automation and embedded computing, with products employed in virtually every industry, including manufacturing automation, defense, automotive, telecommunications, healthcare and aerospace. GE Fanuc Intelligent Platforms is a worldwide company head-quartered in Charlottesville, VA, and is part of GE Enterprise Solutions.