VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, announced the VIA EPIA P700 Pico-ITX board that couples more features within a streamlined, ultra compact footprint designed for low profile systems, with extended I/O port options through two companion boards. Now featuring native S-ATA II support, Gigabit LAN, and support for GPIO, SM bus and LPC devices, the 10cm x 7.2cm VIA EPIA P700 is based on the VIA VX700 unified digital media IGP chipset and is powered by a 1GHz VIA C7 or fanless 500MHz VIA Eden ULV processor. An integrated power adapter coupled with the 5-volt S-SATA power cable negates the need for a separate power daughterboard, saving considerable space for ultra compact systems.
Linear on-board pin-header placement means developers can use a single cable to effortlessly connect various I/O devices in a streamlined way that reduces cable clutter. Flexible battery placement is also geared towards improved miniaturization, making the VIA EPIA P700 the most slimline Pico-ITX board yet.
Two companion boards make light work of design implementation and product testing. The P700-A board features an RJ45 port, a VGA port and a COM port, while the P700-B sports four USB ports and three audio jacks for multi-channel surround sound. The two companion boards fit seamlessly with the streamlined linear pin-headers on either side of the VIA EPIA P700 to enable ultra low profile devices.
“VIA has listened to its customers to learn how we can add even greater features to our products,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Pico-ITX continues to evolve in tandem with the needs of our customers, addressing the challenge of producing full-featured, ultra compact embedded systems that can be brought to market as quickly and as easily as possible.”
About the VIA EPIA P700 Pico-ITX Board
The VIA EPIA P700 Pico-ITX board is powered by either a 1.0GHz VIA C7 or fanless 500MHz VIA Eden ULV processor and supports up to 1GB of DDR2 system memory. The VIA VX700 unified digital media IGP chipset boasts 2D/3D AGP graphics and video decoding acceleration for WMV and MPEG-2/4 video through the VIA UniChrome[TM] Pro II IGP graphics core. The VIA VT1708B high definition codec offers eight channel audio and DTS multi-channel digital surround sound for an all-round high fidelity experience.
The VIA EPIA P700 negates the need for a traditional power board with an integrated +12V DC 2-pin power jack and lock which also includes a 5V S-SATA power cable.
The VIA EPIA P700 has both an onboard IDE and S-ATA II ports. I/O connectivity through pin-headers and bundled companion cards include a Gigabit Ethernet port, a CRT/DVI header, a LVDS port, a COM port, 3 audio jacks, 4 USB 2.0 ports, a PS/2 port and an LPC/SM Bus/GPIO pin header.
VIA EPIA P700 Pricing and Availability
VIA EPIA P700 Pico-ITX boards are available now for developers; for pricing and availability, please contact your local VIA sales representative or send an email to: email@example.com
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators.