Aviza Technology Unveils Versalis fxP for 3D-IC Manufacturing

Aviza Technology, Inc. (NASDAQ:AVZA), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, announced the introduction of the Versalis fxP, a 200/300 mm cluster system targeted for 3D-IC manufacturing using through silicon via (TSV) technology. Aviza is at the forefront of developing this unique integrated process solution for research and development (R&D) that encompasses multiple steps, including Etch, PVD and CVD, in order to deliver functional 3D-IC packages and accelerate time-to-market for such products.

The Versalis fxP is based on Aviza’s production-proven single-wafer platform, which can incorporate up to six process modules. Its individual modules such as deep silicon etch, PVD and CVD have all been proven in high-volume manufacturing for various applications including wafer level packaging, MEMS and power semiconductors. The Versalis fxP platform combines all of the critical processes needed to create a via ready for plating. This “one-stop shop” solution enables customers to invest less capital for R&D, minimizing installation costs and optimizing use of their fab area.

“By leveraging Aviza’s process expertise in the areas of etch, PVD and CVD, the company has introduced an innovative system, the Versalis fxP, which offers a unique integrated processing solution to the R&D community focusing on 3D-ICs using TSV technology,” said Kevin Crofton, Vice President and General Manager, PVD/CVD/Etch Business Unit of Aviza Technology, Inc. “Customers will benefit from Aviza’s process expertise in these three process areas in order to meet our customers’ manufacturing requirements for next-generation 3D architectures. On one platform, customers can develop their TSV processes in a cost-effective and efficient manner with the ability to seamlessly migrate them to the production environment.”

TSV Approach
Three key elements are driving the design of advanced consumer products, increased functionality, reduced size and lower cost. These are the very same drivers that are pushing the adoption of 3D-ICs and the associated required packaging technologies. The two most common technologies for 3D-IC packaging are wire bonding and TSV to establish the electrical connectivity between the components of the stacked die.

An increasingly important factor in favor of TSV is that it can consume up to 30 percent less Silicon than the wire-bonded equivalent, because wire bonding can only connect around the periphery of the device. Recently, the raw cost of Silicon has risen over 10x fueled by solar cell demand, significantly changing the cost comparison picture between TSV and wire bonding. Further, this requirement for additional Silicon to satisfy wire-bonders means that less die can be manufactured on the source wafer, putting additional pressure on profit margins. In addition, TSV is gaining wider adoption by 3D-IC manufacturers, as this approach has demonstrated the ability to keep the interconnect distance very short and removes any real limitation on the number of die that can be stacked in this manner. As a result, TSVs can enable smaller form factor devices and has demonstrated improved device speed and functionality.

3D-ICs using TSV technology have numerous applications, including NAND Flash Memory, Image Sensors, Sensors and DSP, DRAM, SRAM, FPGA and Memory, Processors, Amplifiers for Wireless LAN, Communication for Mobile Phones and Military applications. Leading market research firm Yole Développment forecasts the compounded annual growth rate (CAGR) for 3D-IC wafers to be above 60 percent by 2012.

“The 3D-IC arena is clearly a growth market with increased activity on numerous fronts,” said Jérôme Baron, Market Analyst at Yole Développment. “TSV processes have shown significant device and performance benefits over other methods. An integrated process approach for TSV will play a critical role in streamlining the development process.”

Unique Integrated Processing Capabilities
For R&D and pilot production, the ideal system solution would be a single toolset capable of four critical, individual process steps in TSV formation: TSV etch, CVD liner & liner etch and PVD. The unique advantage of such an approach enables dramatically shortened TSV development time.

With all three process technologies (etch, PVD and CVD) on board, the Versalis fxP offers much smaller footprint, compared to three individual systems, and a single install minimizing cost and disruption to the cleanroom, thus reducing the overall development and processing time to deliver the first wafer out. In addition, this type of system allows R&D users to link separate processes without breaking vacuum to discover potential performance benefits, and then apply those findings to optimally configure production systems — which would not be possible on traditionally configured single-process systems.

For full volume production capability, the individual process modules would be installed onto additional handlers, each one dedicated to each of the separate processes — a feature offered by the Versalis fxP system. This approach can only be realized if the process modules all shared common mechanical interface and control systems. This leads to minimal process re-qualification, an additional advantage for adopting an integrated hardware and process approach for TSV-based 3D packaging.

About Aviza Technology, Inc.
Aviza Technology, Inc. designs, manufactures, sells and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. The company’s systems are used in a variety of segments of the semiconductor market, such as advanced silicon for memory devices, advanced 3-D packaging and power integrated circuits for communications. Aviza’s common stock is publicly traded on the NASDAQ Global Market (NASDAQ GM: AVZA). Aviza is headquartered in Scotts Valley, Calif., with manufacturing, R&D, sales and customer support facilities located in the United Kingdom, Germany, France, Taiwan, China, Japan, Korea, Singapore and Malaysia.