Tundra Semiconductor Corporation (TSX:TUN), a leader in System Interconnect, announced that Texas Instruments, Inc. (TI) has selected the Tsi574[tm] RapidIO® Switch to cluster TI’s wireless infrastructure optimized DSPs on their TMS320TCI6484 AMC evaluation platform. The 1 GHz TCI6484 single core DSP and evaluation module, launched in February for select TI customers, targets Beyond3G applications including HSPA/HSPA+, LTE and WiMAX Wave 2.
The evaluation module includes Tundra’s Tsi574 RapidIO Switch to interconnect TI’s processors on the board, leveraging Tundra’s high performance interconnect capability and based on Tundra’s interoperability track record with TI’s suite of high bandwidth DSPs.
“The Tundra Tsi574 pairs nicely with the TCI6484 evaluation module,” said Ramesh Kumar, marketing director for TI’s wireless infrastructure business unit. “The Tsi574 switch offers 10Gpbs of interconnect across the board, enabling rapid processing for data-intensive applications.”
High bandwidth applications, such as wireless infrastructure designs, require multiple high performance DSPs for data processing. Tundra’s RapidIO Switch technology allows multiple DSPs on a single board to pass high bandwidth data at maximum transfer rates.
As wireless infrastructure designs strive to keep up with the increasing demands of bandwidth intense applications, such as the transfer of video, music, and images, next generation base station OEMs must consider scalability and maximum performance requirements.
About Tundra RapidIO® Switches
Tundra switches provide chip-to-chip interconnect between RapidIO end-points and can replace existing proprietary backplane fabrics for board-to-board interconnect. As a founding member of the RapidIO Trade Association and long-time Steering Committee member, Tundra continues to provide leadership in the development of the RapidIO standard and was the first semiconductor vendor to bring Parallel and Serial RapidIO switches to market. RapidIO is the leading serial interconnect standard for embedded systems and is supported by industry leaders such as, Alcatel- Lucent Technologies, AMCC, EMC Corporation, Ericsson, and Freescale Semiconductor. The Tundra family of RapidIO switches includes the Tsi620[tm], Tsi578[tm], Tsi576[tm], Tsi574[tm], Tsi572[tm], Tsi568A[tm], and Tsi564A[tm].
Tundra Semiconductor Corporation (TSX:TUN) supplies the world’s leading communications, computing and storage companies with System Interconnect products and design services backed by world-class customer service and technical support. Tundra’s track record of product leadership includes over a decade of bridges and switches enabling key industry standards: RapidIO®, PCI, PCI-X, PCI Express®, Power Architecture[tm], VME, HyperTransport[tm], Interlaken, and SPI4.2. Tundra’s products deliver high functional quality and simplified board design and layout, with specific focus on system level signal integrity. Tundra’s design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra’s technology connects critical components in high performance embedded systems around the world.
TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation in Canada, the United States, the European Union and the People’s Republic of China. Design.Connect.Go. and Tsi574 are trademarks of Tundra Semiconductor Corporation. RapidIO is a trademark of the RapidIO Trade Association Inc.