Apache Design Solutions DAC Booth Features Methodology Presentations

Apache Design Solutions will host methodology presentations by designers from Broadcom, IBM, STMicroelectronics, Texas Instruments, Toshiba, and TSMC at this years’ 45th Design Automation Conference (DAC) in Anaheim, California. The designers will share their best practices on critical design challenges such as SoC power and noise sign-off, custom IP validation, and chip-package co-design.

Apache Design Solutions, Booth #2311
Design Automation Conference, Anaheim Convention Center, Anaheim, CA

  • Broadcom: Reducing jitter in DDR interface
    June 10, 2:00 pm
    June 11, 10:00 am
  • IBM: Power integrity and low power design analysis
    June 9, 12:00 am
  • STMicroelectronics: Embedded memory validation
    June 10, 11:00 am
  • Texas Instruments: EMI noise modeling and compliance
    June 9, 11:00 am
  • Toshiba: Chip-package-system co-design for cost reduction
    June 11, 1:00 pm
  • TSMC: Power integrity and signoff methodology
    June 9, 2:00 am

The company will also be demonstrating their complete line of power, noise, and reliability platform solutions for SoC and package/PCB designs. Demonstrations and presentations will include:

  • SoC dynamic power analysis from early design to signoff
  • Low power verification including MTCMOS, VTCMOS, and LDO
  • Methodology for early stage analysis from prototype to design
  • Analog, mixed-signal power integrity
  • Chip-Package-System co-design
  • Package and PCB power and signal integrity
  • Hands-on-Tutorial on chip-package co-design methodology

About Apache Design Solutions
Apache delivers the leading power signoff solution adopted by 80% of the top IDM, fabless semiconductor, and foundries and a complete platform for silicon integrity of low-power, high-performance system-on-a-chip (SoC) designs. Apache’s innovative platform considers multiple noise sources that impact the design — such as power, signal, package / system IO, substrate, and temperature — and enables designers to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon and/or system. Apache’s vendor-neutral solution supports any industry-standard physical design flow and is certified by TSMC and Common Platform Reference Flows. Apache is a global company with R&D centers and direct sales / support offices worldwide.

Apache Design Solutions, NSPICE, RedHawk, PakSi-E, PakSi-TM, PsiWinder, Sahara, Sentinel, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.