The Design Automation Conference (DAC), the electronic design automation (EDA) industry’s premier event, revealed the winners of its annual student design contest. The awards will be presented on June 9 at 12 p.m. in the Pavilion Panel (Booth 364) on the show floor with each winner receiving travel costs to DAC courtesy of this year’s sponsors. Winning submissions also will be displayed as posters at the DAC University Booth on the exhibit floor. The 45th DAC will be held in Anaheim, Calif. at the Anaheim Convention Center, June 8 – 13, 2008.
The nine winning teams, selected from nearly 60 entries, were recognized from three categories: operational chip design, for an IC design which was built and tested; operational system design, for FPGA or other programmable architectures; and conceptual, in which a project was designed and simulated, but not necessarily implemented. The 2008 Student Design Contest co-chairs are Bill Bowhill, senior principal engineer, Intel Massachusetts, and Byunghoo Jung, assistant professor of Electrical and Computer Engineering, Purdue University.
2008 DAC/ISSCC Student Design Contest Winners
242mW, 10mm2 1080p H.264/AVC High Profile Encoder Chip
Yu-Kun Lin, De-Wei Li, Chia-Chun Lin, Tzu-Yun Kuo, Sian-Jin Wu, Wei-Cheng Tai, Wei-Cheng Chang, Tian-Sheuan Chang – National Chiao-Tung Univ., Hsinchu, Taiwan
Low Power Carbon Nanotube Chemical Sensor System
Taeg Sang Cho, Kyeong-jae Lee, Jing Kong, Anantha P. Chandrakasan – Massachusetts Institute of Technology, Cambridge, Mass.
iVisual: An Intelligent Visual Sensor SoC with 2790fps CMOS Image Sensor and 205GOPS/W Vision Processor
Chih-Chi Cheng, Chia-Hua Lin, Chung-Te Li, Liang-Gee Chen – National Taiwan Univ., Taipei, Taiwan
Samuel C. Chang – Massachusetts Institute of Technology, Cambridge, Mass.
XCXO: An Ultra-low Cost Ultra-high Accuracy Clock System for Wireless Sensor Networks in Harsh Remote Outdoor Environments
Thomas Schmid, Jonathan Friedman, Zainul Charbiwala, Young H. Cho, Mani B. Srivastava – University of California, Los Angeles, Los Angeles, Calif.
Vision Platform for Mobile Intelligent Robot Based on 81.6 GOPS Object Recognition Processor
Donghyun Kim, Kwanho Kim, Joo-Young Kim, Seungjin Lee, Hoi-Jun Yoo – KAIST, Daejon, Republic of Korea
MIPS R2000 Implementation
Nathaniel Pinckney, Thomas Barr, Michael Dayringer, Matthew McKnett, Nan Jiang, Carl Nygaard, David Money Harris – Harvey Mudd College
Joel Stanley, Braden Phillips – The University of Adelaide, Adelaide, Australia
PicoCube: A 1cm3 Sensor Node Powered by Harvested Energy
Yuen-Hui Chee, Mike Koplow, Michael Mark, Nathan Pletcher, Mike Seeman, Fred Burghardt, Dan Steingart, Jan Rabaey, Paul Wright, Seth Sanders – University of California, Berkeley, Berkeley, Calif.
3Gbps/30K-Rule Virus-Detection Processor Embedded with Adaptively Dividable Dual-Port BiTCAM for Mobile Devices
Chieh-Jen Cheng, Chao-Ching Wang, Kuan-Ching Chuang, Tai-An Chen, Tien-Fu Chen, Jinn-Shyan Wang – National Chung-Cheng University, Chia-Yi, Taiwan
Silicon Odometer: An On-Chip Reliability Monitor for Measuring Frequency Degradation of Digital Circuits
Tae-Hyoung Kim, Randy Persaud, Chris H. Kim – University of Minnesota, Minneapolis, Minn.
The contest accepts designs for analog, digital or programmable circuits and systems. Submissions can be embodied as integrated circuits (ICs), reconfigurable processors, systems on chips (SoCs), platform-based or embedded systems designs. The design must be part of the students’ course or research work at the university and must have been completed within 18 months prior to the submission deadline.
Full-time graduate and undergraduate students interested in the 2009 Student Design Contest should check the DAC Web site for the call for entries.
Industry and Corporate Dedication to Continued Education
The Student Design Contest was founded by the University of Utah’s Kent Smith in 1981, and has been managed by DAC since 2000. In 2002, DAC began partnering with ISSCC to promote and manage the contest. Each year, the successful tradition of the Student Design Contest is made possible by a group of engineering community and corporate sponsors. In addition to DAC and the ISSCC, this year’s sponsors include the ACM/SIGDA, the IEEE Council on EDA (CEDA), the IEEE Circuits and Systems Society, Mentor Graphics, Semiconductor Research Corporation (SRC), Synopsys, and Tanner EDA.
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for Electronic Design Automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,500 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. A highlight is its Exhibition and Suite area with approximately 250 of the leading and emerging EDA, silicon and IP providers. The conference is sponsored by the Association for Computing Machinery’s Special Interest Group on Design Automation (ACM/SIGDA), the Circuits and Systems Society and Council on Electronic Design Automation of the Institute of Electrical and Electronics Engineers (IEEE/CASS/CEDA) and the Electronic Design Automation Consortium (EDA Consortium).