Real-Time Systems Introduces Latest Hypervisor Software
Real-Time Systems GmbH announced the availability of the latest version of its Real-Time Hypervisor software. Available immediately, this software product, which was demonstrated for the first time last week at the RadiSys Technology Day in Germany, enables the simultaneous running of multiple operating systems on multi-core processors, and also supports Microsoft Windows XP.
LeCroy Announces WavePro 7 Zi Series Oscilloscope
LeCroy Corporation’s new line of WavePro digital oscilloscopes, Serial Data Analyzers, and Disk Drive Analyzers — the 7 Zi Series — integrates performance, speed, and a user interface optimized for analysis to enhance the design, debug and validation process beyond any other instrument in the 1.5 GHz to 6 GHz bandwidth range. A superior feature finder, a new rare event capture technology, and the deepest toolbox with the greatest horsepower combine for powerful debug capability. Exceptional responsiveness and 10-20 times faster processing throughput lead to more efficient validation. A new form-factor and the largest display available on any oscilloscope make finding root cause easier. The breakthrough performance of the WavePro 7 Zi Series provides engineers with deeper insight into electronic design problems than possible before.
Elma Electronic Rolls Out Eco-Friendly 12R1 Line of Rugged Enclosures
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced a more eco-friendly 12R1 line of rugged COTS system platforms. The enclosure is lighter and uses RoHS-compliant materials. Elma’s line of 12R1 enclosures are up to 20% lighter than the standard 12R2 line of rugged COTS chassis. This contributes for fuel savings for mobile (Air, Sea, Land) applications. The lighter units also help avionics and other applications meet weight constrictions. The system platforms are modular and come in various sizes and configurations. This includes 19″ rackmount enclosures in 3U, 5U, 7U, and 10U heights and 22″ and 25″.
CSR, Skyhook Wireless Team on Wi-Fi Positioning
CSR, a leading global provider of wireless technologies, and Skyhook Wireless, maker of the Wi-Fi Positioning System and XPS 2.0, the hybrid positioning system, announced a partnership that will bring advanced location capabilities to CSR’s Wi-Fi silicon. Skyhook Wireless’ core technology, the Wi-Fi Positioning System (WPS), is software that produces accurate location information by detecting Wi-Fi access points and comparing them against a known database of geo-located points. By combining CSR’s UniFi, embedded Wi-Fi chips, and GPS location solutions with Skyhook’s positioning capabilities, this partnership will enable device makers to more easily support and launch location based services that satisfy consumer location needs.
Analog Devices Rolls Out AD7190 Sigma-Delta Converter
Analog Devices, Inc. (NYSE: ADI), the global leader in data converter technology, is enabling industrial equipment manufacturers to expand the operating speed and precision of sensitive measurement instruments with the introduction of a sigma-delta ADC (analog-to-digital converter) that features the industry’s best combination of data rate and noise-free resolution. While the resolution of competing devices degrades quickly at speeds beyond 1 kHz, ADI’s 24-bit AD7190 sigma-delta ADC achieves greater than true 16-bit noise-free resolution up to 2.4 kHz across all input voltages from 40 mV to 5 V.
Semiconductor Chip Sales Grow by 7.5% to $20.3 Billion in May
Worldwide sales of semiconductors of $21.8 billion in May were 7.5 percent higher than the $20.3 billion reported for May 2007, the Semiconductor Industry Association (SIA) reported. May sales were 2.8 percent higher than the $21.2 billion reported for April 2008. Year-to-date sales of $103.4 billion are up by 5.3 percent from the $98.2 billion reported for the first five months of 2007. Total semiconductor sales excluding memory products were up by 12.3 percent year-on-year and by 2.5 percent sequentially. SIA noted that May is historically a relatively strong month for semiconductor sales.
Analog Devices AD7626 PulSAR ADC Sets New Benchmark Record
Analog Devices, Inc. (NYSE: ADI), the global leader in data converter technology, expanded its PulSAR® family of precision 16-bit SAR ADCs (successive-approximation register analog-to-digital converters) with a breakthrough in data conversion that delivers an unequalled combination of speed and accuracy. The ability to process information at higher speeds while preserving data integrity is a key requirement in today’s most advanced industrial and medical systems. For example, in medical MRI (magnetic resonance imaging) and digital X-ray systems, the speed and accuracy supported by the new PulSAR ADC enables medical procedures to be conducted more quickly and accurately, reducing the time patients must lie motionless during MRI examinations and reducing X-ray radiation exposure.
Power Integrations Shares LinkSwitch-II Design Ideas
Power Integrations (Nasdaq:POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, announced a series of design ideas to help designers of LED driver circuitry benefit from the company’s recently introduced LinkSwitch-II family of AC-DC power conversion ICs. The new design ideas (DI-184, DI-185 and DI-186), demonstrate that LinkSwitch-II ICs are well suited for power supplies and ballasts driving high-brightness LEDs. The devices’ highly accurate constant-current performance and low external component count enable LED ballasts that are simpler to design, lower-cost, and more durable than existing converter technology.
AWR, UMS Unveil Process Design Kit for GaAs pHEMT Foundry Process
AWR® and United Monolithic Semiconductors (UMS) introduced an advanced process design kit (PDK) for the UMS PPH25X GaAs pseudomorphic high electron mobility transistor (pHEMT) foundry process. The UMS PPH25X process is dedicated to the design of microwave monolithic integrated circuits (MMIC) at frequencies up to 35 GHz. The PDK lets users take advantage of the industry-leading fabrication capabilities of UMS together with AWR’s innovative Microwave Office® design suite.
Amkor to Feature New Flip Chip Packaging Technology at SEMICON West
Amkor Technology, Inc. (Nasdaq: AMKR) announced the introduction of a new flip chip packaging technology to be featured at SEMICON West2008 July 15 – 17. The breakthrough in high performance flip chip packaging utilizes an advanced molding process technology that is expected to provide a number of design, cost and performance advantages for field programmable gate arrays, CPUs, graphics processors and ASICs that are widely used in embedded processing applications like PCs, servers, switches and personal gaming machines. The new molding process establishes a platform technology, with the first package offering for flip chip (over) molded ball grid array called FCMBGA.
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