EnOcean Alliance Standardizes Wireless Controls for Sustainable Buildings
A group of key companies across North America and Europe have united to form the EnOcean Alliance. The Alliance’s mission is to enable intelligent green buildings based on EnOcean energy harvesting wireless technology. The Alliance has selected Lightfair 2008 as the platform for its official launch. Founding promoters of the Alliance include Masco, Leviton, EnOcean, Distech Controls, MK Electric (a Honeywell subsidiary), Omnio and Thermokon. Additional member companies, such as Texas Instruments and Sylvania Osram, are joining the Alliance at the ‘participant’ level.
Ralink Announces RT3052, RT3050 802.11n Access Point, Router SoC
Ralink Technology Corporation, a leading developer of 802.11x chipsets, announced the industry’s first 802.11n single chip AP (Access Point)/routers SoC (System On Chip) with integrated five-port 10/100 Ethernet Switch and PHY. The RT3052 is an 802.11 b/g/n, 2T2R single chip with USB OTG, RGMII, SPI, PCM, I2C and UART interfaces and RT3050 is an 802.11 b/g/n, 1T1R (1 Transmit 1 Receive) single chip with USB interface.
MAZeT Introduces JENCOLOR True-Color Color Sensors
MAZeT GmbH, an international product and design house for color and spectral sensoring, presents its highly temperature-stable and uniquely precise JENCOLOR True-Color color sensors. These quality features necessary for color controlling RGB-LEDs have been confirmed in comprehensive testing: deviations in light color and changes in color temperature under all operating conditions were found to be below levels perceivable by the human eye. At stand 328 in hall 7, the leading provider of True-Color sensors and sensor modules also showcased its extensive range of high-precision solutions for controlling and color-controlling LEDs.
MCCI Achieves Simultaneous Wireless USB Embedded Device Class Support
MCCI, a leading developer of Universal Serial Bus (USB) software technology, announced advanced support for complex, multi-function devices over Wireless USB for major consumer electronics markets. This breakthrough brings the full richness of wired USB functionality to wireless support for mobile handsets, digital photography, navigation devices and media players. MCCI has demonstrated simultaneous embedded device class support for Mass Storage, Modem, OBEX, PictBridge, Media Transfer Protocol (MTP) and ENCM Ethernet over a Certified Wireless USB (CWUSB) connection.
Denali Announces First Full DDR3 DIMM IP Solution
Denali, Inc., a world-leading provider of electronic design automation (EDA) software and intellectual property (IP), announced the immediate availability of its Databahn(TM) DRAM memory controller and hard PHY IP with full DDR3 dual in-line memory module (DIMM) support designed for bulk-memory and caching applications, including networking, storage and personal computing. Denali announced embedded systems support for discrete DDR3 DRAM chips last year as memory vendors began offering new devices to support data rates up to 1600Mbit/s per pin. This new DDR3 DIMM offering adds unique capabilities in the memory controller and PHY IP that are needed for networking, storage and personal computing systems using DDR3 modules at data rates up to 12.8GBytes/s per DIMM.
TI Unveils INA210 Zero-drift, Bi-directional Current Shunt Monitors
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a family of high- or low-side measurement, bi-directional current shunt monitor integrated circuits (ICs) in SC70 packages. Utilizing a zero-drift bi-directional architecture, the INA210 family provides outstanding accuracy up to 1 percent over the -40C to +125C temperature range, with 35uV maximum offset. The near elimination of offset with zero-drift reduces the voltage drop and power dissipation in the accompanying shunt resistor by an order of magnitude, which reduces cost and circuit board real estate. The ICs can be used in a wide variety of applications, including servers, telecom equipment, automotive, battery management, computers, power supplies and test equipment.
Extreme DA to Demonstrate GoldTime at Design Automation Conference
In booth 1364 at the 45th Design Automation Conference (DAC), Extreme DA[tm] will exhibit the newest version of its next-generation timing sign-off solution, GoldTime[tm], now with multi-dimensional optimization (MXO[tm]). The fast-growing company is the emerging leader in next-generation timing analysis software that improves the performance and yield of nanometer integrated circuits (ICs) with unmatched speed and analysis capacity and addresses process variations in semiconductor designs.
Intel, Micron Develop First Sub-40nm NAND Flash Memory Device
Intel Corporation and Micron Technology, Inc. introduced the industry’s first sub-40 nanometer (nm) NAND memory device, unveiling a 34nm 32 gigabit (Gb) multi-level cell chip. This process technology was jointly developed by Intel and Micron and manufactured by the companies’ NAND flash joint venture, IM Flash Technologies (IMFT). It is the smallest NAND process geometry on the market. The 32 Gb NAND chip is the only monolithic device at this density that fits into a standard 48-lead thin small-outline package (TSOP), providing a cost-effective path to higher densities in existing applications. Shipments of customer samples begin in June and mass production is expected during the second half of this year calendar.
Kontron Introduces KISS PCI-759 Multi-core Industrial Servers
Kontron announced its latest range of 2U and 4U KISS industrial servers that bring Intel® Core[tm]2 Duo processor performance to PICMG 1.0 based PCI/ISA applications. These long term available, ultra quiet (<35 dB) industrial servers are especially designed for applications that require high data processing performance without the need for high-speed PCI Express features.
Step-by-step Functional Verification with SystemVerilog and OVM
Cadence Design Systems, Inc. (NASDAQ: CDNS) and Mentor Graphics Corp. (NASDAQ: MENT) announced the publication of the industry’s first book covering the widely adopted Open Verification Methodology (OVM). Step-by-Step Functional Verification with SystemVerilog and OVM is written by Dr. Sasan Iman, an industry leader in the functional verification space. Iman is a principal with SiMantis Inc. and the former director of simulation technology at Escalade Corp. whose previous books on the e verification language and low-power design methodologies have been well received by the design and verification community. The new book from Hansen Brown Publishing is being promoted by Cadence and Mentor on the OVM World Web site to help the OVM community better understand and use the popular methodology.
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