Apache Design Solutions, the technology leader in power, noise, and reliability (PNR) signoff for chip, package, and system designs, announced version 8.1 release of PakSi-E, its IC package and System-in-Package (SiP) extraction and analysis tool. This latest version delivers over 10X faster runtime performance than previous versions with a next generation capacitance extraction algorithm. In addition, with PakSi-E 8.1, the extraction engines of the standalone version and the unique version embedded in the Cadence Design Systems IC package and SiP flows are now identical.
“PakSi-E 8.1 is the first major release since Apache acquired Optimal in November, 2007, and it is truly a next generation in IC package and SiP analysis that underscores Apache’s commitment to this market and to the Optimal customers,” said Dave DeMaria, senior vice president of Chip-Package-System at Apache. “One of PakSi-E’s longtime advantages has been the ability to perform full package extraction. As package design size and complexity increases, the improvement in runtime performance by over 10X will allow our customers to extract and analyze their designs much more effectively.”
“Cadence and Optimal have partnered for over five years in IC packaging and SiP to provide customers with the best integrated solution for 3D package modeling. We are pleased to have extended our relationship with Apache as a preferred technology partner in this market,” said Keith Felton, group director of marketing, Cadence Design Systems. “Now that the latest PakSi-E engine is available in our solutions and is identical to the standalone version, our customers can leverage the latest capabilities, such as multi-port coupling and ease-of-use.”
In addition, PakSi-E 8.1 contains a number of new usability and performance enhancements that will improve productivity, including:
- Improved multi-core extraction for resistance and inductance
- Single pass flow to perform multi-port coupling
- Additional DRCs
- Configurable defaults and settings
Apache will be demonstrating PakSi-E 8.1 at CDNLive! EMEA 2008 in Munich, Germany on April 28th & 29th, and will be available to all customers at the end of Q2.
About Apache Design Solutions
Apache delivers the leading power signoff solution adopted by 80% of the top IDM, fabless semiconductor, and foundries and a complete platform for silicon integrity of low-power, high-performance system-on-a-chip (SoC) designs. Apache’s innovative platform considers multiple noise sources that impact the design–such as power, signal, package/system IO, substrate, and temperature—and enables designers to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon and/or system. Apache’s vendor-neutral solution supports any industry-standard physical design flow and is certified by TSMC and Common Platform Reference Flows. Apache is a global company with R&D centers and direct sales/support offices worldwide.
Apache Design Solutions, NSPICE, RedHawk, PakSi-E, PakSi-TM, PsiWinder, Sahara, Sentinel, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.