ADLINK Technology, Inc., a global provider of trusted embedded products, announced the DPAC-3000, its newest Distributed Programmable Automation Controller (DPAC) for the machine automation industry. The compact embedded controller offers a distributed control solution for digital and analog I/O and motion control, while enabling a 15 to 20 percent cabling reduction compared to other Programmable Logic Controller (PLC) and Programmable Automation Controller (PAC) solutions on the market today.
“The machine automation industry is undergoing a major shift from the centralized configurations of current PLC and PAC products to distributed control solutions, such as the DPAC-3000,” said Jeff Munch, chief technology officer at ADLINK. “With centralized systems, it is difficult to expand functionality and excess cabling gets in the way; however, with distributed control solutions, the integrated fieldbus significantly reduces cabling and functionality can be extended with a generic Ethernet cable.”
Equipped with a fast, time-deterministic fieldbus, the standalone DPAC-3000 offers significant cabling reduction and faster installation, all in a cost-effective and compact form factor. The DPAC-3000 features a rugged embedded platform with a front control panel for system integrators to design their own user control interface, which can be used for a variety of applications, including monitoring purposes, and parameter setting and checking.
The DPAC-3000 provides system integrators in the machine automation field with simplified configuration and ease of installation, as well as high shock endurance up to 100 G. ADLINK’s DPAC product line features well-integrated motion, I/O and communications functionality.
The DPAC-3000 series of embedded automation controller systems combines embedded PC technology and distributed I/O modules to form a compact, vertically mountable, and highly-extendable Programmable Automation Controller (PAC) solution. The DPAC-3000 supports configurations based on the AMD® Geode(tm) LX800 and Intel® Celeron® M.
The DPAC-3000 will be available April 30, 2008.
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include ETX and COM Express modules for industrial computing, AdvancedTCA, CompactPCI, PCI Express-based data acquisition and I/O and vision and motion control. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices. ADLINK is an Associate Member of the Intel® Embedded and Communications Alliance.
Intel, Intel Atom, Pentium, and Intel Core may be trademarks of Intel Corporation in the U.S. and other countries.