Siemens Wireless Announces MC75i, TC65i, TC63i, MC55i M2M Modules

Siemens Wireless Modules announced at CTIA Wireless 2008 the introduction of four new scalable M2M modules to fit a wide range of applications and business needs. This entirely new product platform – comprised of MC75i, TC65i and TC63i modules – offers optimized performance, a more compact size and enriched features. Additionally, the new MC55i module offers improved functionality and an ultra thin form factor while remaining compatible with its successful predecessors MC55/56.

In addition to shared technology – Quad-Band GSM, TCP/IP functionality, and M2M interfaces such as serial or I2C bus – MC75i, TC65i and TC63i are equal in size, mounting arrangement and command set, ensuring full compatibility. Key feature enhancements include operating under -40°C for use in extreme temperature ranges all over the world, the latest in performance technology with ARM 9 processors, and customized jamming attack detections. MC55i packs Quad-Band GSM/GPRS baseband, TCP/IP connectivity and a RIL driver for Microsoft® Windows Mobile(tm) 6-based devices into a very compact package and features an extra stable mount, full shielding and MC55 and MC56 compatibility.

“We’ve designed these products to fit the widest range of applications and budgets, while allowing complete flexibility between modules as companies’ technology needs change,” said Peter Fowler, general manager, Siemens Wireless Modules. “Improvements in size, processing and extreme environmental conditions help ensure we’ll continue to be at the forefront of both M2M development and customer satisfaction worldwide.”

Each module’s performance varies in terms of data transmission speed and can be integrated for varying M2M needs including cost and power-sensitive applications like metering, security, remote maintenance and control, vending, POS, PCMCIA cards, laptops and many more. The new modules include:

  • MC75i – For EDGE (Enhanced Data Rates for GSM Evolution), the fastest transmission standard in GSM. This module features a TCP/IP stack, serial and USB ports, and RIL driver for Microsoft® Windows(tm) Mobile based devices.
  • TC65i – The JAVA(tm) Virtual Machine — high performance, open platform module. This device runs on embedded hardware, like the ARM9 processor and the memory which is tuned and aligned to it. It leverages this platform-and-processor combination alongside GPRS technology, a TCP/IP stack, and an array of industrial interfaces such as SPI, I2C bus, AD/DA converter, and GPIOs to speed up time to market and cut development costs.
  • TC63i – Top of the scale M2M connectivity – GPRS Class-12 functionality, an integrated TCP/IP stack and comes without the onboard software developer platform. It’s perfect for applications where a microcontroller is already available and only a high-performance wireless communications connection is needed. It embodies the grow-as-you-go benefits of this triple module package: It can be used to satisfy basic GPRS needs, and then as demand for EDGE technology grows, switched to the MC75i without reinvesting money to redevelop the application.
  • MC55i – Quad-Band miniaturized module – This module comes with a SIM application toolkit and packs Quad-Band GSM/GPRS, TCP/IP connectivity based on GPRS Class 10 data transmission and a RIL driver for Microsoft® Windows Mobile(tm) 6-based computing into a very thin form factor. Its extra stable mount, full shielding and small size make it ideal for PDAs, smartphones and mobile computing applications including laptops, PCMCIA cards, vending, security metering and more.

MC75i, TC65i and TC63i measure 33.9 x 30 x 3.3 mm in size and are backwards compatible with MC75, TC65, and TC63. MC55i measures 35 x 32.5 x 2.95 mm and is backward compatible with MC55 and MC56. For more information about Siemens Wireless Modules, visit www.siemens.com/wm or visit CTIA 2008 booth #5327 at the Las Vegas Convention Center, April 1-3.

About Siemens Energy & Automation
Siemens Energy & Automation, Inc. is one of Siemens’ operating companies in the U.S. Headquartered in the Atlanta suburb of Alpharetta, Ga., Siemens Energy & Automation, Inc. manufactures and markets one of the world’s broadest ranges of electrical and electronic products, systems and services to industrial and construction market customers. Its technologies range from circuit protection and energy management systems to process control, industrial software and totally integrated automation solutions. The company also has expertise in systems integration, technical services and turnkey industrial systems.

Siemens AG (NYSE:SI) is one of the largest global electronics and engineering companies with reported worldwide sales of $107.4 billion in fiscal 2006. Founded nearly 160 years ago, the company is a leader in the areas of Medical, Power, Automation and Control, Transportation, Information and Communications, Lighting, Building Technologies, Water Technologies and Services and Home Appliances. With its U.S. corporate headquarters in New York City, Siemens in the USA has sales of $21.4 billion and employs approximately 67,000 people throughout all 50 states and Puerto Rico. Eleven of Siemens’ worldwide businesses are based in the United States. With its global headquarters in Munich, Siemens AG and its subsidiaries employ 475,000 people in 190 countries. For more information on Siemens in the United States: www.usa.siemens.com.