As the provider of the broadest line of controller, CPU and specialty DSP processors on the market today, Tensilica, Inc. is recognized as an industry leader with its low-power, benchmark-proven processor cores. The company has been selected to participate in presentations and panels at the Multicore Expo held April 1-3, 2008, in San Jose, California.
Wednesday, April 2
11:45 a.m. – 12:30 p.m.
“Are Virtual Platforms an Enabler for Multi-Processor SOCs?”
Grant Martin, Tensilica chief scientist, panelist
Wednesday, April 2
4:30 – 5:00 p.m.
“Program Control for Asymmetric Tasks in a Multicore Multimedia SOC”
Greg Marlan, Tensilica senior hardware applications engineer, presenter
Thursday, April 3
9:50 – 10:20 a.m.
“The Architecture and Design of Multicore Video Processing Systems”
Gulbin Ezer, Tensilica hardware design manager, presenter
The Multicore Expo
Santa Clara Convention Center
Santa Clara, California
About Multicore Expo
The Multicore Expo includes executive and engineering keynotes, panel discussions, and in-depth technical presentations and case studies covering a wide range of multicore-related topics. Individual sessions will address multiprocessor tactics and business strategies, programming and debug, software tools, electronic system level (ESL) technologies, and APIs for multicore communications, to name just a few. Exhibits and demonstrations will provide the opportunity to see multicore technology in action.
Tensilica, Inc., is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors on the market today – including full software toolchain and modeling support – in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provide semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals.