Tensilica CEO to Discuss Energy Breakthroughs in Chip Design

Chris Rowen, Tensilica CEO, will present “Energy Breakthrough in Chip Design: Big Challenges, Bigger Rewards” at the Globalpress Electronics Summit, on Monday, March 31, in San Francisco. The presentation will highlight the ability to reduce energy consumption by combining multi-core design with optimized processors. He will highlight Tensilica’s Xenergy energy estimation tool, which has a new graphical user interface so designers can easily check the energy effects of various trade-offs.

In addition, Steve Roddy, Tensilica’s vice president of marketing, will participate in a panel that day discussing new semiconductors, hardware, software and services that will be needed to meet the demand of the digital consumer who will want to access, view and consume multimedia content anytime and anywhere.

  • “Energy Breakthrough in Chip Design: Big Challenges, Bigger Rewards” presentation by Chris Rowen, CEO, Tensilica
    Monday, March 31, 10:00 – 10:30 a.m.
  • “The Future of Multimedia Content and Distribution” Panel including Steve Roddy, vice president of marketing, Tensilica
    Monday, March 31, 11:00 a.m. – 12:00 p.m.

The Globalpress Electronics Summit takes place March 31 – April 3, at the Kabuki Hotel, San Francisco, California.

About Globalpress Electronics Summit
The Globalpress Electronics Summit provides a venue for the world’s leading technology companies and innovative start-ups to showcase their news and views on the future of electronics, design tools and new applications to the world’s top 50-plus electronics journalists.

About Tensilica
Tensilica, Inc., is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors on the market today – including full software toolchain and modeling support – in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provide semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals.