Tensilica,® Inc. and NuFront announced that the two companies will jointly exhibit at the IIC-China 2008 exhibitions March 3-4, 2008, in Shenzhen (booth: 2K41) and March 10-11, 2008, in Shanghai (booth: 4S41). Using Tensilica’s configurable processor technology, NuFront developed, and has gone into mass production with, a T-MMB (terrestrial-mobile multimedia broadcasting) mobile baseband DSP (digital signal processor). By watching mobile TV on a T-MMB phone, visitors will be able to experience NuFront’s technology in action.
The T-MMB mobile TV standard is in the running to be adopted throughout China, and there are plans to have this in place in time for the Beijing Olympics.
NuFront’s T-MMB mobile TV baseband chip employs Tensilica’s Xtensa® configurable processor. “Tensilica’s Xtensa processor was very attractive for our next design because standard processor cores couldn’t give us the performance we needed,” stated Hamilton Yong, COO, NuFront Software. “The only way to get the performance was to optimize the processor, and Tensilica is the only company with the automated tools to make that customization much easier and ensure our success.”
Tensilica also will showcase its processor cores at IIC-China, including its video DSP, Diamond Standard RISC CPUs and the popular HiFi 2 Audio Engine, the most popular commercial audio core on the market, designed into millions of cellular phones.
Tensilica, Inc., is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors on the market today – including full software toolchain and modeling support – in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provide semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals.
Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc.