RadiSys Corporation (NASDAQ:RSYS), a leading global provider of advanced embedded solutions, announced the introduction of a COM Express module that targets value-priced industrial automation, gaming, and test & measurement applications. The Procelerant(tm) CE945GM2A replaces older ETX technology at a comparable price point, enabling high-speed serial interface options such as PCI Express, Serial ATA (SATA) and gigabit ethernet.
Based on the value-priced Intel Celeron M processor 440, the Procelerant(tm) CE945GM2A allows customers to achieve higher processor performance at a value entry point using the COM Express modular form factor. The product can be combined with a RadiSys-designed low-profile active heat sink with an embedded fan allowing the module to be used in 1U platforms. The module and heat sink combination enable rapid design-in by removing the need for the customer to create a heat sink solution that can effectively cool a 1U system.
“Device manufacturers for markets like industrial automation, test & measurement, and gaming need innovative ways to support value-oriented price points with newer technologies,” said Wade Clowes, vice president, RadiSys commercial segment. “Customers have expressed the need to move away from legacy specifications like ETX, so that they can support current and future processors and I/O technologies on a modular form factor. COM Express accomplishes these goals with a truly open standard that prevents supplier lock-in, and this new RadiSys module lets our customers adopt COM Express at a price point that is very competitive with ETX.”
“RadiSys has again demonstrated its customer- and application-driven approach to product development by expanding both processing power and price point options for its customers,” said Eric Heikkila, the Director of Embedded Hardware & Systems with VDC. “With this new value-priced module, companies can leverage a single COM Express carrier platform that uses anything from an entry-level Celeron M processor to the latest high-end Intel®Core2 Duo processors. This will enable customers to expand the market of their COM Express-based products into a broad range of new applications.”
About Procelerant COM Express
RadiSys Procelerant(tm) COM Express modules are designed for embedded applications that require a standard processor and memory subsystem, but also modular flexibility to retain key design level IP on a separate carrier board. Procelerant COM Express products are based on COM Express®, a computer-on module standard that provides a bridge from legacy interfaces such as PCI and IDE to new serial differential signaling technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial DVO.
Because they are modular and standards-based, RadiSys COM Express products help equipment manufacturers shorten their time to market and reduce development costs. By removing the processor, chipset, and memory from the rest of the design, manufacturers can focus engineering resources on developing differentiating features and avoid the design churn that comes with implementing new processor generations. RadiSys also provides a wide range of custom carrier services that further accelerate customer time-to-market by supplying carrier concept definition and design, carrier schematic reviews, BIOS customization and thermal design.
RadiSys (NASDAQ:RSYS) is a leading provider of advanced solutions for the communications networking and commercial systems markets. Through intimate customer collaboration and combining innovative technologies and industry-leading architecture, RadiSys helps OEMs, systems integrators, and solution providers bring better products to market faster and more economically. RadiSys products include embedded boards, application-enabling platforms, the OS-9 operating system, and turn-key systems, which are used in today’s complex computing, processing, and network-intensive applications. For more information, write to email@example.com, or call 800-950-0044 or 503-615-1100.
RadiSys® and Procelerant(tm) are registered trademarks of RadiSys Corporation.