3DLABS to Demonstrate Microsoft Windows CE BSP for DMS-02 Processor

3DLABS Semiconductor, a pioneer in media-rich application processors, announces that it will be demonstrating its Windows CE BSP (Board Support Package) at Embedded World, Nuremberg, Germany, 26-28th February. The BSP takes full advantage of the DMS-02′s fully programmable media processing array and dual ARM architecture to deliver unrivalled application and media performance for embedded and low-power consumer electronics devices such as connected media players, portable navigation units, service terminals, smartphones and gaming devices.

3DLABS will be demonstrating with Microsoft on stand #11-318.

Manoj Rami, senior marketing manager, Windows Embedded Business Group, Microsoft EMEA comments: “3DLABS’ continued innovation on our platform shows how its market leading approach to providing better and faster processor solutions delivers unrivalled application and media performance in embedded and low-power consumer electronics devices.”

The Windows CE 5.0 BSP is supported on the latest DMS-02 Development System, a small footprint connected platform that includes; UI features (800×480 24-bit LCD resistive touch screen, keyboard, mouse, buttons, microphone, headphone, line-in/out and speakers), connectivity (WiFi, USB), storage (2Gbyte NAND, NOR Flash, SDCard, SDHC/MMC+ slot,) and video I/O (HDMI TV encoder, analog TV encoder, VGA Camera).

“This Windows CE 5.0 BSP marks an important milestone in enabling our customers to take advantage of an industry-leading OS to bring feature rich devices to market quickly and efficiently,” said Tim Lewis, director marketing, 3DLABS Semiconductor. “By combining our intimate knowledge of our DMS-02 processor with a Windows CE BSP we can jump-start the product development of our customers and partners working in the Microsoft Windows CE eco-system.”

The DMS-02 media-rich applications processor is a multi-core System-On-Chip that combines two ARM(r) 926 cores with 3DLABS’s proprietary SIMD array processor and an industry standard set of peripheral functions. The fully programmable array performs all the media intensive tasks such as 2D/3D graphics, video encode/decode and image processing, offloading the ARMs and leaving them free to run CPU friendly tasks.

The Windows CE 5.0 BSP and supported DMS-02 Development System are expected to ship to partners during Q1 2008.

About 3DLABS Semiconductor
3DLABS Semiconductor is a pioneering fabless semiconductor supplier of fully programmable media processors that deliver a rich mix of video, imaging, 2D/3D graphics, audio and floating-point capabilities. Based on an array of floating-point processing elements and dual ARM(r) cores the architecture has the performance, flexibility and low power consumption required to target a broad range of devices; portable media players, navigation systems, automotive infotainment, video conference and surveillance, mobile handsets and embedded systems. 3DLABS was originally founded in 1994 and has experience in developing fully programmable visual computing solutions with expertise in complex silicon design, parallel processing, hardware design and software development, including pioneering work on OpenGL 2.0 and OpenGL ES. 3DLABS has design centres based in England, and offices in Milpitas, California and Huntsville, Alabama. 3DLABS Semiconductor is currently a wholly-owned subsidiary of Creative Technology Ltd.

3DLABS Semiconductor is a registered trademark of 3DLABS Inc., Ltd. in the United States and/or other countries.