Inphi® Corporation, the world leader in analog performance and signal integrity, announced the 3200EC 10 Gbps Dual Clock Data Recovery (CDR) with Electronic Dispersion Compensation Engine (EDC) for use in 10GBASE-LRM (LRM) XFP modules. The feature-rich single-chip device integrates Inphi’s patented analog signal processing EDC technology with XFI-compliant transmit and receive CDRs in a compact 7mm x 7mm QFN package. Replacing up to three separate chips, the 3200EC simplifies the design and reduces the bill of materials of an XFP transceiver module. Used with Inphi’s field-proven 1348TA Linear Trans-Impedance Amplifier (TIA), the 3200EC offers a total solution to reduce development costs and accelerate delivery of standards-compliant 10GBASE-LRM XFP modules to the market. The 3200EC is the latest addition to Inphi’s industry-leading PhyOptik(TM) product family. See Inphi at OFC, Booth 719.
“Currently, there are no XFP solutions for 10 Gigabit Ethernet backhaul on the installed base of legacy multimode fiber. The 10GBASE-LRM standard was specified to solve this problem, but has previously not been available in this form factor due to its unique combination of power, performance and small size,” said John Monson, vice president of PhyOptik marketing at Inphi Corporation. “The 3200EC has been specially designed to enable this new generation of Ethernet connectivity for enterprise switch customers.”
The 3200EC is a single-chip dual CDR with receiver EDC, suitable for building LRM-compliant XFP transceiver modules. Based on Inphi’s Analog Signal Processing (ASP) EDC technology, the device offers robust performance across the LRM-specified Comprehensive Stressed Receiver Sensitivity Tests (CSRST) and optical power ranges. The 3200EC has been extensively tested with linear TIA’s from multiple manufacturers, including the Inphi 1348TA, to ensure operation across all module operating conditions. When used in combination with the 1348TA, the 3200EC offers transceiver module manufacturers a one-stop proven solution, minimizing development efforts and accelerating product delivery schedules.
To ensure module compliance to XFP MSA specifications, the 3200EC features an XFI-compliant host-side interface, including input equalization and output pre-emphasis, establishing a robust 10 Gbps link between the module and the host system. In addition, the two integrated CDRs meet the XFP MSA jitter tolerance, jitter transfer bandwidth, and jitter peaking requirements with ample margin. The device also offers a built-in XFI-compliant Loss of Signal (LOS) pin for direct connection to the module RX_LOS pin. Line-side and host-side loopback functions are also integrated to aid in debugging during development or in the field.
Owing to the integration of multiple functional blocks and the patented EDC technology, the 3200EC achieves lower power consumption and reduced bill of materials than equivalent solutions. Furthermore, the on-board microcontroller and non-volatile memory enable the device’s standalone operation, hence simplifying module design. As a result, optical transceiver modules fully compliant to the LRM and XFP MSA specifications are realizable in under 2.5 W of power.
The 3200EC is offered in a RoHS-compliant 7mm x 7mm 48-pin QFN package, with an operating case temperature range of 0 to 85 degrees Celsius.
The 3200EC is available immediately as engineering samples with mass production expected in Q2 2008.
About Inphi Corporation
Inphi Corporation designs and develops integrated circuits that consistently deliver the industry’s highest performance and best signal integrity for processing high-speed digital data in computing and communications systems. The company is a leading supplier of memory interface logic, optical components and high-speed logic. Leading corporations rely on Inphi for components that transport, store, deliver, and test high-speed data for the world’s most innovative communications and computing systems. Inphi is recognized as a global technology leader for its excellence in design, dedication to the development of open standards, and commitment to R&D.