Tensilica, Inc. announced that Samsung Electronics Co., Ltd. has signed a broad multi-year license for Tensilica’s Diamond Standard 330HiFi audio DSP (digital signal processor). Tensilica’s HiFi architecture is the most popular commercial audio core for system-on-chip (SOC) designs. Samsung will use the Diamond Standard 330HiFi audio DSP in mobile handset and other designs.
“Tensilica’s HiFi 2 audio DSP architecture is a widely adopted, advanced DSP core with over 30 voice and audio encoder and decoder software packages readily available,” stated G. S. Han, vice president of Samsung Electronics, System LSI Division. “After a thorough technical evaluation of Tensilica’s HiFi offering, we found that the Diamond 330HiFi was the right audio DSP for Samsung and will be a key DSP in our IP portfolio for years to come.”
“We are very pleased that Samsung, a key player in the mobile phone chipset market, has selected the Diamond Standard 330HiFi audio DSP,” stated Chris Rowen, Tensilica’s president and CEO. “This validates the growing momentum for the HiFi 2 Audio Engine architecture as the de facto industry standard IP offering for high-fidelity, ultra-low-power audio.”
The Diamond Standard 330HiFi is a processor core that includes the HiFi 2 Audio Engine, which has been optimized to efficiently run over 30 different audio software packages. This processor can encode and decode multiple audio standards to meet the needs of today’s ever evolving consumer audio products ranging from cellular phone handsets to home entertainment systems. Supported audio packages include: Dolby® Digital AC-3 and Dolby Digital Plus, MP3, MPEG-2/4 AAC LC, MPEG-4 aacPlus V1 and V2, Ogg Vorbis, WMA, AMR, G.729AB speech, AM3D, QSound, SONiVOX, EAS, and SRS.
Tensilica, Inc., is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors on the market today – including full software toolchain and modeling support – in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provide semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals.
Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. Xplorer is a trademark of Tensilica, Inc. Virtex is a trademark of Xilinx, Inc.