A recent analysis of SEMI Fab Database reports show that spending on fab construction projects and fabs equipping will likely see double digit declines in 2008 as many fab construction projects are put on hold or pushed out to end of the year or into 2009. Spending on equipping fabs in 2008 is expected to decline 15 percent compared to the nine percent growth last year. The analysis represents a downward revision of the outlook reported in the October 2007 Fab Database Report.
The reports indicate a decline in equipment spending by almost ten percent for foundries, about 15 percent for memory, and about 30 percent for the logic/MPU segment.
Spending on fab construction projects is expected to decline in 2008 by nine percent, compared to the strong growth in 2007. In 2008, 12 new volume fabs are expected to start construction, which represents a total capacity addition when fully operational of 1.53 million wafers per month (wpm) in 200 mm equivalents. The five biggest spenders on fab construction projects in 2008 are expected to be Flash Alliance (Toshiba/Sandisk JV), Samsung, Hynix, Rexchip (Elpida/Powerchip JV) and Powerchip.
Semiconductor manufacturing capacity is projected to grow by about 11 percent in 2008, which is consistent with the numbers reported in the October 2007 edition of the report. Memory still retains the largest share of total fab capacity, and is expected to increase this year to 41 percent from 38 percent in 2007.
Memory fabs are projected to increase capacity by 18 percent year over year, followed by logic/MPU, which are expected to see five percent growth. Foundries are forecasted to add about eight percent more capacity.
About the Fab Capacity Report
Provides a comprehensive listing of over 1,000 fabs worldwide and features details by company and by fab in over 12 categories (including capacity ramps, geometries, wafer sizes, product types and regions) and covers three years – the past six quarters and the next six quarters. This report is in an easy to use Excel format and lists by quarter and by fab capital expenditure for fabs constructing and equipping, capacities, geometries, product types, and wafer sizes and more. NEW features include: Capital expenditures of fabs equipping and includes fabs with construction projects.
The Next Six Quarters lists fab details of two years: for the past two quarters and the next six quarters for more than 200 fabs in which major expenditures are taking place. The report is in an easy to use Excel format and lists by quarter cost of construction and equipment spending by fab, the capacities, geometries and wafer sizes, key milestone dates and more.
SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.