UMC University Program Members to Present Papers at ISSCC

UMC (NYSE: UMC, TSE: 2303), a leading global semiconductor foundry, announced that its University Program members are presenting eight papers here this week. The papers unveil innovative semiconductor technology developments. The presentation of these papers demonstrates the success of UMC’s University Program in cultivating university talent to develop the foundation for research and development of technologies that will help to enable the next generation of system-on-chip (SoC) technologies.

“UMC is excited to be well represented at this distinguished conference through the eight papers selected from our University Program. We are especially proud of the hard work of the professors and students involved which make this program a continuing success,” said Dr. KC Wang, chief engineer of system & architecture support at UMC. “Over 80 papers have been published in prestigious technical journals and conferences over the past three years from organizations directly sponsored by the UMC University Program. We look forward to further helping foster the future talent of the semiconductor industry through close work with our university partners.”

Specific papers to be presented during this week’s ISSCC conference include:

  • iVisual: An Intelligent Visual Sensor SoC with 2790fps CMOS Image Sensor and 205GOPS/W Vision Processor, by C.-C. Cheng, C.-H. Lin, C.-T. Li, S. Chang, C.-J. Hsu, and L.-G. Chen of National Taiwan University
  • A 1.2mW, 1.6Vpp-Swing Class-AB 16O Headphone Driver Capable of Handling Load Capacitance up to 22nF, by V. Dhanasekaran, J. Silva-Martinez and E. Sánchez-Sinencio of Texas A&M University
  • An 8-x-3.2Gb/s Parallel Receiver with Collaborative Timing Recovery, by Agrawal, P. Hanumolu and Gu-Yeon Wei of Harvard University
  • A Process-variation-tolerant Floating-point Unit with Voltage Interpolation and Variable Latency, by X. Liang, D. Brooks and Gu-Yeon Wei of Harvard University
  • A 242mW, 10mm2,1080p H.264/AVC High-Profile Encoder Chip, by Yu-Kun Lin, De-Wei Li, Chia-Chun Lin, Tzu-Yun Kuo, Sian-Jin Wu, Wei-Cheng Tai, Wei-Cheng Chang, and Tian-Sheuan Chang of National Chiao Tung University
  • A 0.6V, 32.5mW Highly Integrated Receiver for 2.4GHz ISM-Band Applications, by A. Balankutty, S.-A. Yu, Y. Feng and Peter Kinget of Columbia University
  • A 1.4mW, 4.90-to-5.65GHz Class-C CMOS VCO with an Average FoM of 194.5dBc/Hz, by P. Andreani of LUND University, Sweden
  • A Clockless ADC/DSP/DAC System with Activity-dependent Power Dissipation and No Aliasing, by B. Schell and Y. Tsividis of Columbia University

UMC collaborates with many universities in Taiwan, the U.S., Canada, and Sweden to advance the cutting-edge of IC design, modeling, EDA, ESD, etc. Through the Program, the university partners gain access to advanced CMOS technologies, develop novel ICs, test them, and analyze the results. UMC provides design kits, technical support, fabrication, and IC packaging. Successful ICs are announced as “IP candidates,” that customers can license from participating universities and develop into real IPs that can be used in SoC products.

About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SoC) designs, including volume production 90nm, industry-leading 65nm, and mixed signal/RFCMOS. UMC’s 10 wafer manufacturing facilities include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States.