CSR, Motorola Form EGPS Forum for Enhanced Global Positioning System
CSR and Motorola announced that they intend to create an open industry forum to evaluate and foster enhanced Global Positioning System (EGPS) technologies. When used on a mobile device, EGPS technologies augment GPS to provide timely and accurate position information in demanding environments. The EGPS Forum is expected to advocate improvement to location technologies in mobile devices and is committed to meeting consumer and regulatory needs for precise and consistent levels of location information.
NXP, Purple Labs Debut Sub-$100 3G Linux Mobile Phone Reference Design
NXP Semiconductors, the independent semiconductor company founded by Philips, and Purple Labs, a leading supplier of embedded Linux solutions for mobile phones, jointly announced the release of a 3G Linux reference feature phone offering video telephony, music playback, high-speed Internet browsing and video streaming at a transfer price below US$100. The new Purple Magic phone serves as a reference design for phone manufacturers creating entry-level 3G handsets, including those targeting mobile markets such as Southeast Asia, Eastern Europe and Latin America.
Altera Receives Excellent Supplier Award from Mindray Medical
Altera Corporation (NASDAQ: ALTR) announced it has received the 2007 “Excellent Supplier Award” from Mindray Medical International Limited (NYSE: MR) as a result of the two companies’ long-term beneficial relationship. Based in Shenzhen, China, Mindray is a leading company in the development, manufacturing and marketing of medical devices. Altera was the only FPGA vendor honored with an award at the 2007 Mindray Supplier Conference.
Avnet Rolls Out Virtex-5 LXT/SXT Development Kit in Asia
Avnet Electronics Marketing, a part of Avnet, Inc. (NYSE: AVT), announces the release of the Xilinx(R) Virtex(TM)-5 LXT/SXT Development Kit — a complete development platform for designing and verifying applications based on the Xilinx Virtex-5 LXT and SXT Field Programmable Gate Array (FPGA) families. The new kits support the LX50T, LX110T, SX50T, or SX95T Virtex(TM)-5 devices, and take advantage of the world’s first 65nm FPGAs.
AWR Reveals Seminar Schedule for North America, Australia
AWR, the innovation leader in RF EDA, will demonstrate how the latest versions of Microwave Office, Visual System Simulator (VSS), and AXIEM software can be the innovative tools behind the scenes that empower designers to deliver their next-generation electronic devices faster, more reliably, and at a lower cost. Technical experts will showcase AWR industry-first technologies: VSS RFA RF architectural tool, AXIEM three-dimensional (3D) planar electromagnetic (EM) software, and Microwave Office ACE(tm) automated circuit extraction tool.
Rudolph Technologies Announces AXi 940 Macro Defect Inspection Module
Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced the availability of the AXi 940 macro defect inspection module. The new AXi 940 module will perform wafer frontside inspection as part of the all-surface Explorer(tm) Inspection Cluster—a multi-surface inspection system designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership. The new module is featured at this week’s semiconductor manufacturing industry trade show, SEMICON® Korea, in Seoul.
SIDSA Unveils Enter e1 Demodulator plus Application Processor Chipset
SIDSA enters the DVB-H semiconductor market with its new Enter e1 demodulator plus application processor chipset. This new chipset complements the current offering of Intellectual Property for DVB-H demodulator. SIDSA is the leading provider of DVB-H demodulator Intellectual Property and counts as IP customers to three of the top semiconductor vendors.
SIDSA Enables Live DVB-H Mobile TV Coverage of CSTB Show in Moscow
SIDSA will be the only company to bring live DVB-H Mobile TV signals to one of the most important trade shows in Russia, the CSTB, that will take place in Moscow, 4th to 7th February. SIDSA will use transmitters from its partner MIER Communications and will showcase the services in Samsung mobile TV phones. SIDSA has a strong presence in Russia, with a commercial office in Moscow, and providing the technology to one of the first DVB-H pre-commercial networks worldwide in the city of Yekaterinburg.
MMCA, JEDEC Publish Embedded MMC and Card Product Standard v4.3
The MultiMediaCard Association (MMCA) and the JEDEC Solid State Technology Association (JEDEC) announced their joint publication of version 4.3 of the Embedded MMC (eMMC) and Card Product Standard. The specification marks an important step in the evolution of eMMC as an industry-leading memory technology, providing a standardized protocol for embedding mass storage flash memory on host systems. The new features build on the eMMC standard, which is currently supported by all major handset and navigation product manufacturers.
Digi Introduces Connect WAN 3G Upgradeable Wireless WAN Router
Digi International (NASDAQ:DGII) introduced the Digi Connect WAN 3G, an upgradeable third generation (3G) Wireless WAN router for primary and backup connectivity to remote sites and devices. It is a targeted function Ethernet-to-cellular router that supports both HSDPA and EVDO 3G standards and adds a cost optimized, high-speed solution to Digi’s industry leading line of cellular routers.
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