Adeneo Releases Windows Embedded CE 6.0 BSP for NXP LPC3180 ARM9 MCU

Adeneo, a Microsoft Windows Embedded Gold Partner with facilities in Europe and in the USA, announced the full commercial release of the Windows Embedded CE 6.0 BSP for NXP LPC3180 ARM9(tm) processor-based microcontroller. This BSP targets the phyCORE LPC3180 board, a standard development platform from PHYTEC. It supports all key features of the LPC3180, including optimized power management, and ARM® Vector Floating Point (VFP) library for CE 6.0.

A free binary evaluation version is available for free, for testing and demonstration purpose. For OEMs willing to perform in depth evaluation and qualification of Adeneo BSP, a free 20 days evaluation of the source code is available under NDA. Adeneo provides also for commercial design the complete source code through an attractive one-time license, without royalties.

Yannick CHAMMING’S, General Manager of Windows Embedded activity at Adeneo, and CEO of Adeneo America says, “We’ve been working with NXP and Phytec for many months now to release a strong and reliable Windows Embedded CE solution for LPC3180 platform. By providing this new solution to market, as well as our expertise to OEMs through consulting, training and turnkey developments on Windows Embedded CE, we provide a key solution to help securing designs in the best time to market.”

Geoff Lees, Product Line Manager at NXP, completes, “Today’s embedded developers demand more from the hardware and software systems. With this version of WIN CE 6.0 supporting VFP and Adeneo’s expertise, our customers can reach the full potential of LPC3000 family.

Jeff Felbeck, Senior Partner Marketing Manager, Windows Embedded Business, Microsoft Corp., added “Adeneo’s close collaboration with NXP and Phytec is a great example of leveraging core competencies to very positive effect. Adeneo’s proven BSP development capabilities greatly helps ensure driver quality, which is a critical component in gaining time-to-market advantage.”

PQOAL compliance for the easiest adaptation to custom designs – Because of its compliance with Microsoft PQOAL (Production-Quality OEM Adaptation Layer) and PQD (Production Quality Device) specifications, these BSPs are the most cost-effective way to develop custom solutions on NXP Chips under Windows Embedded CE with the minimal redesign. Only the portions of the BSPs handling board features need to be reviewed and redesigned and all code linked to the core CPU can be reused without modifications.

Fully-featured to cover all customer applications – The BSPs includes all the drivers for most of the peripherals integrated in LPC3180 chips, including USB, Serial, SPI, I2C, as well as key features of the chip such as power management and Vector Floating Point support. This allows targeting all types of custom solutions.

Strong reliability to warrant the best quality – The BSPs are qualified using the Windows Embedded CE official test kit, and has been designed to take full advantage of the advanced features of the LPC3180 such as Advanced Power Management for both idle and suspend mode.

About Adeneo
Adeneo is a leading design center in complete hardware and software custom design. Adeneo offers services in hardware and software engineering especially in industrial environments, with a strong emphasis on embedded and/or real-time developments. With nine years of experience in Windows Embedded solutions, and thanks to its relationships with Silicon Vendors and Microsoft, Adeneo is the key industry partner for complete hardware and software designs targeting rich-featured high end products. Its facilities located both in Europe and North America brings strong local support to its customers on a worldwide aspect. Adeneo was named “Systems integrator of the year” by Microsoft in 2007.

About NXP
NXP is a top 10 semiconductor company founded by Philips more than 50 years ago. Headquartered in Europe, the company has 37,000 employees working in 26 countries across the world. NXP creates semiconductors, system solutions and software that deliver better sensory experiences in mobile phones, personal media players, TVs, set-top boxes, identification applications, cars and a wide range of other electronic devices.