DATE 08 Conference

For the 11th edition of the DATE conference the Technical Programme Committee has received a record number of paper submissions in a wide variety of subjects, particularly in the area of Embedded Systems and Software, turning DATE into the most important conference on system design from software to hardware. The product of these submissions is an exciting technical programme, which is now available in print and online. Early registration discounts for the DATE Conference expire on February 20th 2008.

The DATE’08 conference offers a strong strategic programme of Executive Management Sessions.

These sessions will address three areas of interest to the global management teams of semiconductor and systems OEMs. Topics will range across current semiconductor and system design trends, looking specifically at design at the system-level, through the status of moves to 45nm semiconductor technologies, and on to the overall prospects for the semiconductor industry at large:

  • Unifying or Overrated: A System Level Design Strategy.
    Significant momentum is building around ESL (Electronic System Level) design, but is the concept living up to much hyped expectations? Is there even a common definition for ESL?
    Moderator: Robert Hum, VP & General Manager, Verification and Test Division, Mentor Graphics
    Executive Panellists:
    Wolfgang Ecker, Principal Engineer, Infineon Technologies, Germany
    Rolf Ernst, Professor, TU Braunschweig, Germany
    Joachim Kunkel, Vice President and General Manager, Synopsys, USA
    Peter Nord, Director of Design, Ericsson, Sweden
    Ken Kanofsky, Marketing Director, Signal Processing and Comms., The MathWorks, UK
    Misha Burich, Senior VP of Research & Development, Altera, USA
  • From IDM to “Fab-Lite”: What Changes in your EDA Strategy?
    Addressing the coming challenges in EDA as companies change from quite “vertically integrated” IC manufacturers to a strategy of reliance on significant more sharing of semiconductor process development.
    Moderator: Richard Wallace, VP, Editorial Director, CMP Technology and Editor-in-Chief, EE Times
    Executive Panellists:
    John Chilton, Senior VP, Synopsys, USA
    Barry Dennington, Senior VP, Corp Innovation & Technology, NXP Semiconductors, Netherlands
    Lucio Lanza, CEO, Lanza Ventures (ARM), USA
    Philippe Magarshack, Vice President R&D, ST Microelectronics, France
    Ivo Bolsens, VP and Chief Technology Officer, Xilinx, USA
  • The Perils of 45nm: A Report on the Move
    An informal “progress report” on the ongoing technology move to designs at 45 nm – Contrasted to the predictions of only a few years ago, how is the move really going? Issues were raised about the need for new design techniques, such as the use of statistical methods and increased manufacturing concerns in order to achieve yields.
    Moderator: T. W. Williams, Engineering Fellow, Synopsys
    Executive Panellists:
    Jean-Pierre Geronimi, Director Technology, ST Microelectronics, France
    Anil Jain, Vice President of IC Engineering, Cavium Networks, USA
    Rudy Lauwereins, Vice President, IMEC, Belgium
    Yoshifumi Okamoto, Director Design Centers, Matsushita/Panasonic, Japan
    Ted Vucurevich, Chief Technical Officer, Cadence Design Systems, USA

In addition to the Executive Management Sessions, Special Technical Sessions run across all three days of the DATE’08 event. These Special Sessions consist of a Panel Session, Hot Topics, Tutorials and Invited Industrial Sessions.

The Technical Panel Session will provide a forum for the controversial discussion of how the semiconductor industry will cope with the issues ahead for design and manufacturing in advanced technologies.

  • PANEL – Caution Ahead: The Road to Design and Manufacturing at 32nm and 22nm
    At 32 and 22 nm, which manufacturing technology changes will be so revolutionary as to cause upheavals in the semiconductor supply chain and on design practices? How will designers “sign off” on a design at 32 nm?
    Moderator: P Wintermayr, Editor,, DE
    Rob Aitken, Senior Architect, Product Technology, ARM, USA
    Rudy Lauwereins, VP, Nomadic Embedded Systems, IMEC, Belgium
    J. Tracy Weed, Director, Manufacturing Products, Synopsys, USA
    Volker Kiefer. VP, CAD and Software Development, Qimonda, Germany
    J. Hartmann, Crolles2 Alliance Director, ST Microelectronics, France

Hot Topic sessions provide an exciting technical overview and insight into emerging new topics, presented by leading experts in the field. They present their view on the relevant issues and their importance for research and development. The Hot topics at Date 08 will be:

  • Quantitative Evaluation for Embedded Systems Design
  • Test Challenges for Low Power Devices
  • Quantitative Productivity Measurement in IC Design
  • Analogue: How to Survive in the Era of Nano CMOS
  • 3D Integration or How to Scale in the 21st Century

The Embedded tutorials have been designed to give an insight into current topics starting from an introductory base. The topics for the DATE 08 Embedded tutorials are:

  • Software for Wireless Networked Embedded Systems
  • ARTEMIS and ENIAC Joint Undertakings: A new approach to conduct research in Europe

Designed to be of great general interest, two Invited Industrial Session have been organised:

  • Industrial System Designs in Transportation and Information Technologies.
    • Tailored solutions for safety-installations in a project for trans-European rail traffic
      W. Fuss, Thales Rail Signalling Solutions GmbH, AT
    • On the verification of high-order constraint Compliance in IC-design
      J. Freuer, G. Jerke and J. Gerlach, Robert Bosch GmbH, DE; W. Nebel, Oldenburg U, DE
    • Industrial IP integration flows based on IP-xact standards
      W. Kruijtzer, P. van der Wolf, E. de Kock & J. Stuyt, NXP Semiconductors, NL; W. Ecker & A Mayer, Infineon Technologies, DE; S. Hustin & S de Paoli, STMicroelectronics, FR
  • System Designs in Information Technologies.
    • Concurrent design and handover of SoC subsystems for enhanced reuse and flow automation
      M. Strik, NXP Semiconductors, NL; A. Gonier, Mentor Graphics, FR
    • Cooperative safety: combination of multiple technologies
      P. Capozio, M Duncan, E Merli, M Siti and R Panazzi, STMicroelectronics, IT
    • System performance optimization methodology for Infineon 32-bit automotive microcontroller
      A. Mayer and F Hellwig, Infineon Technologies, DE

DATE’08 EXHIBITION: Will be OPEN from MARCH 11 till MARCH 13, 2008
DATE’08 Conference: MARCH 10 till MARCH 14, 2008