Open Core Protocol International Partnership (OCP-IP) announced that Comtech EF Data, CréVinn Teoranta, ENSTA, Princeton University, Silicon Image and Tata ELXSI joined the organization. The six new members illustrate the industry-wide acceptance and adoption of the OCP standard. Comtech EF Data, a subsidiary of Comtech Telecommunications Corporation, designs and manufactures an assortment of satellite communications equipment deployed in commercial and government applications around the world. Their product lines include modems, modem accessories, bandwidth & capacity management, converters, transceivers, amplifiers, terminals, and more.
Founded in May 2002, with a core ASIC design team from 3Com’s Silicon Design Group, CréVinn Teoranta offers design services and IP for networking, computing, automotive and industrial markets. CréVinn has been instrumental in developing pioneering ASICs and IP cores for market leading products including: layer-N switches, gigabit and 10 gigabit ethernet controllers, hardware accelerators for network processing tasks such as TOE, encryption and wireless cores, and high-speed interprocessor bus switches.
The École du Génie Maritime, founded in 1741, merged with four other schools in 1970 to become ENSTA. ENSTA has become one of the top 10 institutes of higher education for engineering in France. Situated in Paris, ENSTA offers high-level training in science and engineering along with excellent research facilities.
Princeton University was chartered in 1746 as the College of New Jersey, British North America’s fourth college. Today, Princeton is a leading research university. As a research university, it achieves the highest levels of distinction in the discovery and transmission of knowledge and understanding, and in the education of graduate students. At the same time, Princeton is distinctive among research universities in its commitment to undergraduate teaching.
Silicon Image, Inc. is a leader in the secure distribution, presentation and storage of high-definition content. Silicon Image offers robust, high-bandwidth semiconductors in the global PC/display, consumer electronics and storage arenas based on its innovative digital interconnect technology. The company broadens market adoption of the DVI, HDMI, and SATA interfaces by licensing its proven intellectual property (IP) cores to companies providing advanced system-on-a-chip (SoC) solutions that incorporate these interfaces.
Tata Elsxi is the technology arm of the multi-billion dollar Tata Group, headquartered in Bangalore, focused on delivering innovation and value through outsourced product design, R&D services and technology development solutions to customers worldwide. Its business divisions include Product Design Services, Innovation Design Engineering, Systems Integration, Visual Computing Labs.
OCP-IP members receive free training and support, software tools, and documentation, enabling them to focus on the challenges of SoC design. Leveraging OCP-IP’s infrastructure eliminates the need to internally design, document, train and evolve a proprietary standard and accompanying support tools, freeing up critical resources for the real design work, while providing enormous cost savings.
“This new group of members represents a diverse set of product offerings, and highlights the broad OCP acceptance and adoption across many markets,” said Ian Mackintosh, president of OCP-IP. “We are very proud to announce and welcome our new members, and look forward to working with them in the future.”
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP’s Governing Steering Committee participants include: Nokia (NYSE:NOK), Sonics Inc., Synopsys [SNPS], Texas Instruments (NYSE:TXN), and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs.