Archive for November 2007

OKI Rolls Out ML8511 SOI-CMOS Technology-based UV Sensor ICs

Posted by EDA Geek News Staff in Components on Thursday, November 29, 2007

Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has started volume shipment of its ultraviolet (UV) sensor ICs, ML8511, starting this month. OKI plans to ship over 100 thousand chips to Hong Kong and the Chinese markets this year.

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Cadence, Micronas Improve Development Process with Verification Audit

Posted by EDA Geek News Staff in EDA Tools on Thursday, November 29, 2007

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Micronas has selected the Cadence® Incisive® Plan-to-Closure Methodology and Incisive Enterprise Manager for verification planning after a joint full functional verification audit helped discover and correct process flaws and areas of improvement for Micronas' overall product development process. In addition, the audit helped bridge communications gaps and improve planning for various project development teams within differing times zones. As a result of the audit, Micronas chose Incisive Specman Elite® Testbench automation. Using Specman Elite's automation capabilities supported Micronas' wide efforts of reducing their design cycle times.

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Atmel Debuts AVR 32-bit FlexRay Platform for In-vehicle Networking

Posted by EDA Geek News Staff in Microcontrollers, Networking on Thursday, November 29, 2007

Atmel® Corporation (Nasdaq: ATML) announced the availability of its AVR® 32-bit FlexRay® evaluation environment. In addition, Atmel will demonstrate its new technology today at the FlexRay day conference held in Stuttgart, Germany with a mockup car implementing advanced in-vehicle networking with X-by-wire drive, steer and brake functions.

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Applied Materials Announces FullVision 45nm CMP Process Control System

Posted by EDA Geek News Staff in Equipment on Thursday, November 29, 2007

Applied Materials, Inc. announced its new Applied FullVision(TM) system that enables real-time control of dielectric CMP1 processes to the 45 nanometer (nm) device node and beyond. The FullVision system couples Applied's patented window-in-pad technology with multiple-wavelength spectroscopy to deliver advanced in situ endpoint capability for a variety of dielectric materials, including oxide, STI2, and poly CMP applications. The system demonstrates high repeatability across all applications with less than 150 angstrom, 3-sigma endpoint accuracy on patterned wafers. A major advance over single wavelength endpoint technologies, the FullVision system offers improved measurement accuracy with 50% higher reliability for dielectric applications.

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NASA Awards Contracts to DSPCon for Data Acquisition, Analysis Systems

Posted by EDA Geek News Staff in Embedded Systems on Thursday, November 29, 2007

DSPCon, Inc., a leading, global supplier of data acquisition, analysis, archiving and recording solutions for high-value military, aerospace and rotating machinery applications, has been awarded four new contracts with the U.S. National Aeronautics and Space Administration (NASA) to provide the agency with advanced data acquisition and analysis systems for a variety of satellite, rocket and aviation testing applications. Financial terms of the contractual agreements were not disclosed.

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Dolomite Accelerates Drug Discovery with Micro Mixer

Posted by EDA Geek News Staff in Other on Thursday, November 29, 2007

Cambridge microfluidics company Dolomite is developing technology that allows the rapid mixing and analysis of chemicals, helping instrument manufacturers worldwide to create faster systems that will accelerate drug discovery and enable more effective point of care equipment.

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