Tundra Semiconductor Corporation (TSX:TUN), a leader in System Interconnect, announced the extension of a technology collaboration and signing of a license agreement with IBM to bring new Power Architecture(TM) solutions to market as part of Tundra’s smart System Interconnect strategy.
In August, Tundra announced that it had entered into a product acquisition agreement to bring to market the first product in its smart System Interconnect strategy. This product, defined by Tundra, will include a Power processor core in 90nm technology and is currently being designed by IBM Global Engineering Solutions to speed the product’s time to market. Today, Tundra and IBM moved a step further and signed a license agreement for a 65nm Power processor core. The new core will be the processing engine of the future smart System Interconnect products designed by the Tundra research and development team.
“Clients have relied on Tundra’s line of high performance host bridge products for systems using Power CPUs. With our new partnership Tundra and IBM will have the opportunity to collaborate on solutions across several markets.” said Steve Longoria, Vice President, Semiconductor Solutions, IBM Systems and Technology Group.
“The Power Architecture is a dominant architecture in the embedded market and IBM is a technology leader in the semiconductor industry. Tundra could not have found a better partner than IBM to deliver leading-edge smart System Interconnect solutions to the large embedded computing market,” said Daniel Hoste, President and Chief Executive Officer, Tundra Semiconductor.
The partnership with IBM and the development of new products in 90nm and 65nm Power Architecture technology will empower Tundra to deliver more products to the market in a shorter timeframe. The combination of IBM leadership core architectures with the l/O management experience in Tundra’s new smart System Interconnect solutions will allow the Company to competitively address newer and larger markets, enabling faster growth for the Company.
Tundra Semiconductor Corporation (TSX:TUN) supplies the world’s leading communications, computing and storage companies with smart System Interconnect products, intellectual property (IP) and design services backed by world-class customer service and technical support. Tundra’s track record of product leadership includes over a decade of bridges and switches enabling key industry standards: RapidIO®, PCI, PCI-X, PCI Express®, PowerPC®, VME, HyperTransport(TM), Interlaken, and SPI4.2. Tundra’s products deliver high functional quality and simplified board design and layout, with specific focus on system level signal integrity. Tundra’s design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra’s smart technology connects critical components in high performance embedded systems around the world.
TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation in Canada, the United States, the European Union and the People’s Republic of China. Design.Connect.Go. is a trademark of Tundra Semiconductor Corporation. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org.