Adeneo Unveils Board Support Packages for Windows Embedded CE 6.0 R2

Adeneo, a Gold Partner in the Windows Embedded Partner Program with facilities in Europe and in the USA, announced during the launch of Windows Embedded CE 6.0 R2 by Microsoft Corp., the full compatibility of all its CE 6.0 Board Support Packages (BSPs) with this new version of the operating system. Furthermore, Adeneo initiate an innovative distribution model by providing a free access for evaluation to the complete source code of all its BSPs.

Adeneo is involved in BSP developments for Windows Embedded CE for many years and edits reference BSPs in partnership with various Silicon Vendors like Atmel Corporation or NXP semiconductors. Adeneo provides also support on Windows Embedded CE BSP for PHYTEC development boards based on Freescale iMX31 and Marvell PXA270 processors.

“Our mission is to provide well maintained and supported reference solutions on Windows Embedded CE to help OEMs securing the success of their design with the best time to market.” said Dominique MOREL, General Manager of Windows Embedded activity for EMEA at Adeneo. “Ensuring the compatibility of our Board Support Packages with Windows Embedded CE 6.0 R2 as soon as it is released shows our commitment in providing reliable and ready-to-use solutions for embedded products requiring innovative features provided by this new release of Windows Embedded CE.”

Yannick CHAMMING’S, CEO of Adeneo America, comments: “With the free access for evaluation to the source code of our BSPs, we now offer to OEMs a complete flexibility for evaluating our solutions. This free access combined with our unique royalty free licensing model offer a competitive reliable solution to OEMs willing to start their design using a well maintained and supported reference solution. Moreover, our engineering offices located both in Europe and North America provide strong support like consulting, training or engineering services to OEMs willing to secure their design by benefiting from our expertise.”

“We are extremely pleased that all of Adeneo’s board support packages (BSPs) are ready for Windows Embedded CE 6.0 R2,” said Dan Javnozon, senior product manager with Windows Embedded at Microsoft Corp. ” “Adeneo’s BSPs together with the new enhancements in CE 6.0 R2 will help customers designing rich-featured high end products that can easily establish connections to Windows Vista, Windows Server 2008 and other devices.”

PQOAL compliance for the easiest adaptation to custom designs – Because of its compliance with Microsoft’s production-quality OEM adaptation layer and production-quality device specifications, Adeneo BSPs are the most cost-effective way to develop custom solutions under Windows Embedded CE with the minimal redesign. Only the portions of the BSPs handling board features need to be reviewed and redesigned and all code linked to the core CPU can be reused without modifications.

Fully-featured to cover all customer applications – Adeneo BSPs are designed to provide reference solutions and therefore include all the drivers for the peripherals integrated in the chips. This allows targeting all types of custom solutions.

Strong reliability to warrant the best quality – Adeneo BSPs have been qualified using the Windows CE Test Kit, and have been certified by Microsoft to help ensure strong quality and reliability.

About Adeneo
Adeneo is a leading design center in complete hardware and software custom design. Adeneo offers services in hardware and software engineering especially in industrial environments, with a strong emphasis on embedded and/or real-time developments. With nine years of experience in Windows Embedded solutions, and thanks to its relationships with Silicon Vendors and Microsoft, Adeneo is the key industry partner for complete hardware and software designs targeting rich-featured high end products. Its facilities located both in Europe and North America brings strong local support to its customers on a worldwide aspect. Adeneo was named “Systems integrator of the year” by Microsoft in 2007.

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