MAX-3D is the world’s first true 3D-aware layout editor. MAX-3D can combine distinct process wafers, and allows the designer to view, edit and connect the independent wafers into one 3D stack chip. This design technique – known as “Through-Si Via Wafer Stacking” – is a new dimension for chip designs. It allows distinct wafers to be stacked on each other, and connected internally. This results in chips with denser designs and higher performance.
For example, a processor design in a 32 nm technology could be combined with a 65 nm memory and a 180 nm Analog device – on the same 3D chip.
Furthermore, no changes need to be made to the foundry-supplied PDKs to incorporate these technologies in MAX-3D. It manages multiple levels and their respective tech files independently *and* collectively.
MAX-3D is the only commercial layout editor capable of Through-Si Via 3D design. It includes connectivity tracing, DRC checking and many other features found in Micro Magic’s production-proven MAX layout editor.
The product and its underlying technology have been in development for several years by one of the industry’s leading experts – Dr Lisa McIlrath – Micro Magic’s Chief Scientist. “I was impressed that MAX was able to provide the required speed and capacity required for these large complex 3D designs” stated Dr McIlrath.
Through-Si Via 3D wafer stack designs are an extreme challenge for design tools. Current large 2D designs can crash many of today’s layout editors. A 3D chip which connects several levels of 2D layouts multiplies the complexity of the design. MAX-3D has demonstrated its capacity by displaying and editing a design of 1.2 Trillion devices – in real time.
Like all Micro Magic products, MAX-3D is fully programmable and customizable, and integrates well with other EDA tools.
MAX-3D will be demonstrated at the RTI Ventures 3D Architectures for Semiconductor Integration and Packaging Conference to be held in Burlingame, CA October 22, 2007. Dr. McIlrath will be presenting a seminar on 3D integrated circuit design at the pre-conference symposium.
Robert Patti, CTO of Tezzaron Semiconductor and a leading expert in 3D chip design, will also present at the 3D Architectures conference. Mr Patti stated “MAX-3D is the world’s first true 3D layout editor. It can handle our biggest designs. It’s the fastest, easiest to use layout editor I’ve seen.”
MAX-3D is available for a 30 day trial to qualified IC design organizations. For more information, Call 408-414-7647.
About Micro Magic, Inc.
Micro Magic, Inc., provides tools, services, and intellectual property (IP) for the design of high-speed, low-power SoCs. The company’s mission is to help designers dramatically reduce the time and cost required to produce high-performance SoC designs. Micro Magic’s advanced EDA tools are built by IC designers for IC designers. They can handle any size design, are production-proven, and are easy to learn. The company’s products have been used to design the datapaths and memory subsystems associated with all types of SoCs, including processors, DSPs, embedded controllers, multi-media, network and graphics chips.