Apache Design, Optimal Offer Webinar on IC-Package Co-Design

Apache Design Solutions, the technology leader in power signoff and complete silicon integrity platform solutions for system-on-chip (SoC), analog, and system designs, announced that it will partner with Optimal Corporation, a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design, to present a free online technical webinar that will explore the symmetrical use of package-aware chip analysis and chip-aware package analysis to address true IC-Package co-design.

Towards True Co-Design: Bridging the Gap between IC and Package Design for Power Integrity
10:00 a.m. PDT, 1:00 p.m. EDT
Tuesday, October 9, 2007

Specifically, this live webinar will discuss:

  • Impact of package on chip power integrity
  • Methodology for power analysis with consideration of package impact
  • Technology for generating core power delivery network model
  • Use of chip power model in package design

About Apache Design Solutions
Apache delivers the leading power sign-off solution adopted by 80% of top IDMs, fabless semiconductor companies, and foundries, as well as complete platform solution for silicon integrity of SoC, analog-IP, and system designs. Apache’s innovative platform considers all sources of noise that impacts the design–such as power, signal, package / system I/O, substrate, and temperature — Apache’s silicon integrity platform enables designers of leading networking, wireless, communication, consumer, and semiconductor companies to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon / system. Apache’s vendor-neutral solutions enable designers to adopt any industry-standard physical design flow and are in production use by over 40 customers worldwide.

About Optimal Corporation
Optimal Corporation is a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design. Its innovative solutions enable design teams to concurrently analyze and optimize the IC with the package and the packaged IC on the PCB. Through seamless integration with all of the major CAD design flows, its solutions help customers achieve fast and efficient design time. Optimal, founded in 1995, is a TSMC Technology Alliance Partner and a member of the Apache Design Automation Partners Program. Optimal Corporation is headquartered in San Jose, Calif.