The International Engineering Consortium (IEC) will present “Creating Technological Innovations – Taking Advantage of Opportunities” at the upcoming Broadband World Forum Europe 2007 in Berlin. Fifty sessions, workshops, plenary panels and keynote addresses will take place this 8-11 October at the Estrel Convention Center with Deutsche Telekom AG as the official host sponsor.
“More than 80 percent of last year’s registrants consisted of executives, directors, and managers,” commented IEC President John Janowiak. “I think the reason we’re able to draw this level of delegation is because of the quality of speakers presented in our educational programming to present the latest cutting-edge information to our delegates.”
Chaired by Wolfgang Schmitz, senior executive vice president of the technology engineering center at Deutsche Telekom – T-Com, the plenary panel will discuss what technological innovations result from the conversion of voice and data transmission and the opportunities and risks for service providers and customers.
Panelists include Mr. Basil Alwan, president of the IP division at Alcatel-Lucent; Mr. Tony Bates, senior vice president and general manager of the service provider technology group at Cisco; Mr. Scott Kriens, chairman and chief executive officer at Juniper Networks; Mr. Stefano Pileri, managing director of technology at Telecom Italia; and Mr. Vicente San Miguel, chief technology officer of Telefónica.
The Broadband World Forum Europe 2007 speakers will analyze technological risks, new opportunities, efficiencies yielded, customer benefits, customer needs, and new customer responsibilities associated with conversion.
Panelist San Miguel commented, “The BBWF Europe has grown through each of its precedent editions, both in number of attendees and content relevance, and it comes right at a very exciting moment in our sector with the arrival of fiber solutions for the residential and the small and medium enterprise segments, along with the data explosion in mobile networks. Business, regulatory, and technical challenges are capital. During this panel, we’ll have the opportunity to share our visions and the state of the art of each one these challenges, and from different points of view: operators, manufacturers, content providers, etc.”
Speaker Kriens added, “In many minds, this debate centers around whether it is the network or the application driving innovation in our industry…we believe that the crux of the argument is actually at a much higher level – it is globalization that drives innovation within both the network and the application. In a flat world, high-performance networking brings secure applications and services together over a single infrastructure to enable a successful business.”
About the Broadband World Forum Europe
The Broadband World Forum Europe conference and exhibition has grown significantly since its début in 2001, offering a wide range of information and communication technologies topics under the large umbrella of broadband. This year’s World Forum features more than 260 industry leaders speaking in more than 50 sessions, workshops, plenary panels and keynote addresses, complemented by more than 110 top vendors from around the globe displaying the latest products and services in broadband technology. Additional featured programming includes the co-located Broadband Content Forum and the InfoVision Awards. With the support of Official Host Sponsor Deutsche Telekom AG, the IEC expects to draw more than 7,500 from more than 120 countries to the Estrel Convention Center this 8-11 October 2007.
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students. In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers.