Group Forms Wafer Level Chip Scale Package Forum, Creates Board

The WLCSP Forum announced its formation, and named its board. The group’s objectives are to promote the adoption of semiconductor devices using wafer level chip scale packages (WLCSP), to establish industry sponsored “best practices” for their utilization and to establish strategies for migration to finer pitch WLCSP products. The California non profit mutual benefit corporation’s board of directors has representatives from the following companies: Amkor Technology Inc., California Micro Devices Corporation, FlipChip International, LLC, Maxim Integrated Products, Inc., Nokia Corporation, and STMicroelectronics. Kyle Baker, of CMD, will serve as its first Chairman. Richard Haas, also of CMD, was named President.

WLCSP Acceptance Growing, Challenges Remain
According to IC Insights’ McClean Report, 6 billion WLCSP devices were produced in 2006, ramping to 19.1 billion units in 2011. Strong market acceptance of these devices is largely due to superior electrical performance, a compact form factor and in many cases, a lower total cost of ownership when compared to other packaging solutions. The WLCSP Forum will be forming topical working groups to address barriers to adoption, best practices, manufacturing and qualification guidelines, and will issue application notes and white papers, as well as recommendations to standards bodies.

WLCSP Forum at International Wafer Level Packaging Conference in San Jose
The WLCSP Forum will hold an open meeting on September 17, 2007, during the 4th Annual International Wafer Level Packaging Conference and Exhibition being held at the Wyndham Hotel in San Jose. The Forum will also have an informational booth to provide further information and recruit new Members. The exhibition will be held on Tuesday and Wednesday, September 18-19, 2007.

About WLCSP Forum
The Wafer Level Chip Scale Package Forum is a non profit corporation focused on promoting the adoption of WLCSP semiconductor devices.