Vendors Support Removable Flash Memory Card, Embedded Memory Solution

Micron Technology, Inc., Nokia, Samsung Electronics, Sony Ericsson, Spansion Inc., STMicroelectronics, and Texas Instruments announced that they support the creation of a far-ranging industry specification for removable memory cards and embedded memory solutions being standardized by the JEDEC Solid State Technology Association (JEDEC), a leading open-standards organization in the semiconductor industry. JEDEC is well known for its expertise in the standardization of component technologies and solutions.

The new specification, dubbed Universal Flash Storage (UFS), reflects the industry’s need for a universal memory solution. Widespread demand for higher densities and higher performance, plus the surging popularity of multimedia content, is accelerating the need for advanced memory solutions in removable card or embedded formats. UFS will provide a revolutionary leap towards supporting very low access times required for memories, as well as enabling high-speed access to large multimedia files, while reducing power-consumption in consumer electronic (CE) devices. The target performance level is expected to be a significant advancement beyond that of the varied flash cards popular today. Today, users experience a three-minute access time for a 90-minute (4 Gigabyte) high-definition movie; with the new standard, this would be reduced to a few seconds.

Major applications such as mobile handsets, digital still cameras and other CE devices will benefit from the convenience of a universal open standard based specification that is intended to reduce the time-consuming process of enabling interoperability among the various types of removable and embedded memory solutions at the system level. UFS is planned to provide consumers in the future with the convenience of a unified removable memory card that can be shared among various mobile, portable and other CE devices without the need for any adaptors.

The UFS standard is expected to be finalized in 2009.