Bustronic Introduces MicroTCA Cube-Format Backplane

Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has announced a new MicroTCA backplane in the Cube style format. The backplane features 6 AdvancedMC, 1 MicroTCA Carrier Hub, and 1 Power Module slot.

The Bustronic backplane has a Star topology and fits in a 4U wide Cube-style MicroTCA portable enclosure. The backplane also features a JSM (J-Tag Switch Module) slot, and connections at the bottom for a Cooling Unit and at the top for temperature sensors. The 12-layer routing includes 12 ports, including Fat Pipe lanes and allocations for PCI-Express traffic.

Bustronic MicroTCA Cube-Format BackplaneThe pinout of Connector 2 of the MCH is the first alternative pinout defined in the MicroTCA Spec. This pinout contains half a Fabric (Fabric B) and three clock networks. The Fabric on this connector is not used at all, instead the according Ports 2 and 3 of the AMCs are connected directly between the cards.

Bustronic also offers MicroTCA backplanes in both Star and Dual Star topologies and in Pico and Subrack formats.

Founded in 1989, Elma Bustronic specializes in the design and manufacture of high-performance backplanes. Elma Bustronic has a complete line of industry-standard backplanes, including CompactPCI, VME, VME64x, H.110 CT, VXI, VXS, and ATCA. Elma Bustronic’s custom design service combines creative engineering, highly sophisticated computer simulation and modern design techniques to offer customized backplanes that meet the most specialized system requirements. A member of the ELMA Electronic group, Elma Bustronic is located in Fremont, California. Elma Bustronic is a member of PICMG, VITA, and the StarFabric Trade Association.