Surfect Holdings, Inc. (OTC Bulletin Board: SUFH), announced that its subsidiary, Surfect Technologies, Inc., a design and manufacturing company offering an innovative single-cell electroplating tool and process for the semiconductor industry has announced a new development program for addressing the requirements of the growing solar cell plating and module packaging industry. Surfect is targeting solar cell suppliers to develop advanced, lower cost interconnect and module packaging technologies leveraging their semiconductor high volume manufacturing experience. Surfect’s solar program will immediately address technology and tools for improving the efficiency and costs for producing solar cells. Surfect’s experience with thin wafer and wafer scale packaging technology should enable more innovative and cost-effective solar products.
“Our Solar program will be focused on providing critical tools and process solutions utilizing technology developed to provide the semiconductor industry cost-efficient, reliable and miniaturized products,” said Steve Anderson, President and CEO. “Our company brings together proven expertise in plating processes as well as a very efficient process tool critical for enabling fast ROIC and scaling for high volume manufacturing required for strong solar industry growth.”
Steve Cho (CTO) commented that, “Our entry into wafer plating for the solar industry is one that allows us to build on already developed in-house processes traditionally used in semiconductor processing. Solar cell manufacturers will benefit by using tools and processes, like the Ascent-200 and Leapfrog-300, which provide advanced levels of flexibility while keeping costs as low as possible.”
Surfect’s current tools for the wafer packaging market will be tailored for the specific requirements of the solar industry and capable of handling thinner wafer formats which can translate to increased solar cell utilization by our customers. Increased plating requirements for solar cells coupled with our thru-via copper development should enable more efficient solar cells. Wafer level packaging miniaturization technology and now solar technology is a key strategic business thrust for Surfect and its customers.
About Surfect Holdings, Inc.
Surfect Holdings, through its operating subsidiary Surfect Technologies, Inc., is a design and manufacturing company offering an innovative single-cell electroplating tool and process that utilizes the industry’s first, programmable Plating Computer(TM) to fabricate high performance, low-cost interconnects, providing immediate solutions to the back-end of the semiconductor manufacturing process.