SUSS MicroTec Unveils Gamma XPress Coating Cluster for Wafer Bumping, LED

SUSS MicroTec (FWB:SMH)(GER:SMH), leading manufacturer of precision equipment for the semiconductor and related markets, launches the Gamma XPress, an advanced coating cluster targeting wafer bumping as well as LED manufacturing applications. The Gamma XPress coating cluster is offered in different configurations designed for specific applications. These include gold bump coating, under bump metal or redistribution coating, high volume LED coating as well as standard and dry film developing. The market-oriented concept of the Gamma XPress combines an efficient and flexible production setup with short lead times, thus helping to keep the customers’ time to market to a minimum.

SUSS MicroTec Gamma XPress: Coating Cluster for Wafer Bumping and LED Manufacturing Applications“The Gamma XPress is the perfect match for today’s most demanding performance requirements in the field of wafer bumping and high volume LED manufacturing,” says Rolf Wolf, General Manager, SUSS MicroTec’s Lithography Division. “This unique coat and develop cluster combines best value and excellent quality addressing the needs for flexible, clean, and reliable coating processes.”

About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, wafer bonders and probe systems as well as equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan.