NASA Selects Tekmicro’s VXS Satellite Communications Development System
TEK Microsystems, Inc. announced it has received an initial order from the NASA Glenn Research Center in Cleveland, OH for its first VXS-based satellite communications development system. The system will be used for Tracking and Data Relay Satellite System (TDRSS) compatibility test sets as part of the Space Communications and Navigation (SCaN) Program. NASA’s SCaN Program is responsible for providing communications and navigation services to the Agency’s flight missions and for supplying terrestrial communications needs. The initial order is part of a proof-of-concept system. Successful development may result in additional orders.
The delivered Tekmicro systems will include Callisto , Janus, Neptune 2 VXS boards. By providing a massive FPGA processing resource at the heart of the VXS communications fabric, Callisto achieves an optimal balance between processing power and IO bandwidth; maximizing the value that can be extracted from the use of FPGAs for signal processing. Janus combines FPGA based DSP processing technology with seven channels of 16-bit, 500 MSPS (mega samples per second) DAC (digital to analog conversion). Janus 6U VME/VXS payload card is the first to provide seven channels of output in one VXS slot with this resolution. It provides a highly flexible platform building block for a number of military signal processing applications. Neptune 2 combines FPGA technology with a dual channel, 2.2 GSPS (giga samples per second) architecture.
About TEK Microsystems, Inc.
Founded in 1981 and headquartered in Chelmsford, Massachusetts, TEK Microsystems, Inc., designs, manufactures and markets a wide range of advanced high-performance boards and systems for embedded real-time data acquisition, data conversion, storage and recording. The Company provides both commercial and rugged grade products which are used in real-time systems designed for applications such as reconnaissance, electronic warfare, signals intelligence, mine detection, medical imaging, radar, sonar, semiconductor inspection and seismic research.
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