FormFactor Introduces Fine Pitch Logic Product for Wire Bond Testing

FormFactor, Inc. (Nasdaq: FORM) announced a new fine pitch logic product designed to address the unique testing requirements of wire bond logic and SOC devices. The new platform features the ability to reduce device pad pitch down to 60 microns, to increase the number of die tested in parallel (simultaneously) to x64, and test at temperatures up to 150 degrees C. All of these features are critical to ensuring the performance, quality and reliability of advanced automotive devices, and extend to broader wire bond logic applications.

“IC reliability and performance testing is especially critical in automotive applications, where semiconductors are used to control a variety of systems such as engine management components, active and passive safety systems, and other mechanisms,” said Igor Khandros, FormFactor’s chief executive officer. “Higher temperature testing at the wafer level helps ensure high reliability and assists manufacturers in achieving their goal of zero defects per million devices. This new product allows our customers to conduct these critical tests while leveraging our probe card’s ability to test more devices in parallel — improving test throughput and lowering the cost-of-test.”

Due to the constraints of conventional cantilever probing solutions, only a few logic devices can be tested in parallel today. As the number of electronic systems increase in automobiles, unit volumes per design and cost pressures are rising. In addition, the integration of Flash memory and other increased functionality is driving up test times for automotive devices — in some cases by an order of magnitude, from a few seconds to up to a few minutes or more. As a result, manufacturers are faced with a need for higher levels of test parallelism to reduce the cost of test.

FormFactor’s MEMS-based probe card with its scalable MicroSpring contact designs allows for significantly higher pin counts and fewer touchdowns per wafer than alternative technologies. By testing more devices per wafer, chip manufacturers can also extend the life of their testing equipment, further extending their cost reduction benefits. FormFactor’s design roadmap for current MicroSpring technology will extend FormFactor’s pitch capability to smaller nodes in the near future.

The new product has been qualified at early adopter customers, with volume ramp anticipated in early 2008.

About FormFactor
Founded in 1993, FormFactor, Inc. (Nasdaq: FORM) is the leader in advanced wafer probe cards, which are used by semiconductor manufacturers to electrically test ICs. The company’s wafer sort, burn-in and device performance testing products move IC testing upstream from post-packaging to the wafer level, enabling semiconductor manufacturers to lower their overall production costs, improve yields, and bring next-generation devices to market. FormFactor is headquartered in Livermore, California with operations in Europe, Asia and North America.

FormFactor and MicroSpring are registered trademarks of FormFactor, Inc.