Lattice Semiconductor (NASDAQ: LSCC) announced that Intellectual Property (IP) provider PLD Applications (“PLDA”) has ported its PCIe XpressLite x1 core to the LatticeECP2M(TM) FPGA family. The newest member of the Lattice ispLeverCORE(TM) Connection program, PLDA is the world’s largest PCI IP core supplier, providing PCI, PCI-X, Compact PCI and PCI Express solutions. The addition of PLDA’s PCI-based solutions expands the range of PCI Express solutions for the 90nm LatticeECP2M FPGA family, and enables creation of high-performance bridging solutions for low-cost FPGA designs.
“Lattice welcomes PLDA’s expertise and support and we look forward to developing mutual opportunities for PCI-X and PCI Express solutions worldwide,” said Chris Fanning, Lattice corporate vice president, Enterprise Solutions. “We continue to see strong market acceptance for the differentiated value and performance now shipping in our 90nm LatticeECP2M family. The availability of PLDA’s solutions for this family gives Lattice customers access to PLDA’s leading PCI technology for bridging and system connectivity solutions.”
“We are pleased to partner with Lattice on our PCIe XpressLite solutions, and further accelerate the strong momentum that is building for Lattice FPGA products,” said Arnaud Schleich, vice president of sales and marketing for PLDA. “Lattice is delivering differentiation through its LatticeECP2M family, and the availability of this solution signals PLDA’s drive to expand the reach of its PCI-based solutions by supporting genuine FPGA market innovation. We look forward to enhancing our XpressLite and XpressRich solutions to support Lattice technology over the coming months.”
About PLDA PCI-based Solutions
PLDA and Lattice offer a complete system solution with the PLDA PCIe XpressLite x1 core, a demo, drivers and the LatticeECP2M PCI Express evaluation board. The core has been validated with the board and is supported by even moderate speed grades of the LatticeECP2M devices. The core takes advantage of the embedded LatticeECP2M PCS (Physical Coding Sublayer) and SERDES. Built as a PIPE (Physical Interface for PCI Express)-compliant core, it also supports full DMA scatter-gather capability, making it suitable for high-bandwidth applications. It offers an attractive, low-cost system solution for tight form-factor systems when implemented in LatticeECP2M small footprint devices such as the LatticeECP2M-20 256 fpBGA. Both the LatticeECP2M PCI Express evaluation board and the PLDA PCIe XpressLite core are compliant with PCI Express version 1.1.
About LatticeECP2M FPGAs
LatticeECP2M FPGAs are an innovative response to the broad range of customers who have been clamoring for low-cost SERDES capability for chip-to-chip and small form-factor backplane applications. The LatticeECP2M family maintains all of the compelling features of the 90nm LatticeECP2(TM) family that are required for high-volume, cost-sensitive applications, while dramatically increasing memory capacity (ranging from 1.2 Mbits to 5.3 Mbits) and DSP resources (ranging from 24 to 168 multipliers). The SERDES integrated into the LatticeECP2M devices has been engineered as a quad-based architecture with 1 to 4 quads, depending on the size of the device. Each quad features four SERDES channels (four complete TX and RX channels), with each channel featuring power consumption as low as 100mW and supporting data rates from 270 Mbps to 3.125 Gbps. A flexible PCS layer that includes 8b/10b encoding, an Ethernet link state machine and rate matching circuitry also are built onto the chip. The SERDES/PCS combination is designed to support today’s most common packet-based protocols, including PCI Express, Gigabit Ethernet, Serial RapidIO and wireless interface standards (OBSAI and CPRI).
The PLDA Xpress Lite core is offered with a full test bench and is supported by Lattice ispLEVERâ version 6.1 service pack 2 design tools. PLDA provides a free two-month trial of the core through its website, and also provides a complete system demo including PCI Express core configuration, memory access and DMA performance metrics. The core is available immediately. Initial LatticeECP2M devices are now in full production, with production release planned for the remaining devices during Q3 of this year. Both the LatticeECP2M PCI Express evaluation board and ispLEVER design tools also are available immediately.
The world’s largest PCI IP core vendor (Gartner, 2005), PLDA designs and sells a wide range of FPGA and ASIC interfacing solutions for the PCI and derivative markets (PCI Express, PCI-X, CompactPCI, and PC104/PC104+). PLDA provides complete solutions to a global market, including IP cores, hardware, software, consulting services and comprehensive technical support provided directly by the IP designers. Profitable since its inception in 1996, PLDA is privately owned and has reported increasing profits for the last seven years. The company’s success is based on doing one thing very well-Intellectual Property Cores (and related boards) for ASICs, Structured ASICs and FPGAs for high-speed busses such as PCI-Express, PCI-X, PCI, PXI and AHB-PCI.
About Lattice Semiconductor
Lattice Semiconductor Corporation provides the industry’s broadest range of Programmable Logic Devices (PLD), including Field Programmable Gate Arrays (FPGA), Complex Programmable Logic Devices (CPLD), Mixed-Signal Power Management and Clock Generation Devices, and industry-leading SERDES products. Lattice continues to deliver “More of the Best” to its customers with comprehensive solutions for system design, including an unequaled portfolio of high performance, non-volatile and low cost FPGAs. Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in communications, computing, industrial, consumer, automotive, medical and military end markets.
Lattice Semiconductor Corporation, Lattice (& design), L (& design), ispLEVER, ispLeverCORE, LatticeECP2, LatticeECP2M and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.