Tundra to Demonstrate Interconnect Products at Freescale Technology Forum

Tundra Semiconductor Corporation (TSX:TUN), will exhibit and demonstrate their comprehensive line of leading System Interconnect products at the Freescale Technology Forum in Orlando, June 25-28, at the JW Marriott and Ritz-Carlton Conference Centre. Tundra’s Chief Technology Officer, Benny Chang, will participate in a panel discussion entitled “Trends in High Speed Interconnects” on Wednesday June 27 at 1:45pm.

Tundra will also present the following sessions:

  • Tuesday June 26 at 11:30am; Developing WiMAX Infrastructure Using Freescale DSPs and Tundra RapidIO(R) Switches; a session that will discuss how deploying a MicroTCA architecture using MSC8144 DSPs and Serial RapidIO switches will provide OEMs low cost OFDM-based WiMAX infrastructure solutions.
  • Thursday June 28 at 9:30am; Software Design in Dual Processor Embedded Systems: presenting software and hardware aspects of designing dual processor systems. This will be demonstrated using a dual Freescale MPC7448 and Tundra Tsi109 solution.

Tundra will highlight the industry’s latest Serial RapidIO and PCI Express products with the following demonstrations at their booth (#1710):

  • Serial RapidIO(R): RapidIO enabled silicon from Freescale and Tundra Semiconductor will be demonstrated working on the STx Serial RapidIO Development Platform. Stop by the Tundra booth to witness RapidIO traffic using commercially available software, hardware and silicon. View RapidIO DSPs, Microprocessors, and Switches from Freescale Semiconductor (MSC8144 and MPC8548) and Tundra Semiconductor (Tsi578[TM]).
  • PCI Express(R): Tundra’s new low latency high throughput PCI Express bridge will be demonstrated in a storage application consisting of a multi-channel SCSI controller connected via the Tsi384(TM) PCI Express to PCI-X bridge, to a host system.

About Tundra
Tundra Semiconductor Corporation (TSX:TUN) supplies the world’s leading communications, computing and storage companies with smart System Interconnect products, intellectual property (IP) and design services backed by world-class customer service and technical support. Tundra’s track record of product leadership includes over a decade of bridges and switches enabling key industry standards: RapidIO(R), PCI, PCI-X, PCI Express(R), PowerPC(R), VME, HyperTransport(TM) , Interlaken, and SPI4.2. Tundra’s products deliver high functional quality and simplified board design and layout, with specific focus on system level signal integrity. Tundra’s design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra’s smart technology connects critical components in high performance embedded systems around the world.

TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation in Canada, the European Union and the People’s Republic of China (registration is pending in the United States). Tsi578, Tsi384, and Design.Connect.Go. are trademarks of Tundra Semiconductor Corporation. RapidIO is a registered trademark of the RapidIO Trade Association.