RadiSys(R) Corporation (NASDAQ: RSYS), a leading global provider of advanced embedded solutions, announced the introduction of a MicroTCA platform development kit aimed at helping telecommunications equipment manufacturers (TEMs) develop network elements geared toward a smaller and more cost effective form factor than existing products. RadiSys will work closely with CorEdge Networks and the North American Components (NAC) business of Arrow Electronics, Inc. (NYSE: ARW) in delivering this complete MicroTCA solution.
Taking advantage of the same Advanced Mezzanine Cards (AMCs) from RadiSys that are used for AdvancedTCA solutions, TEMs can now address MicroTCA-based network element requirements for the access market while achieving wire-speed packet processing needs. The RadiSys Promentum(R) SYS-3005DK MicroTCA Development Kit is the company’s latest solution to take advantage of OCTEON(TM) processors from Cavium Networks. The kit provides high density Gigabit Ethernet interfaces with sophisticated dataplane hardware acceleration, and helps equipment manufacturers reduce research and development costs while accelerating the introduction of high performance products.
“As TEMs continue to look more closely at the MicroTCA form factor, they quickly see that it provides a flexible approach to building network elements that address a unique set of price and performance needs,” said Anthony Ambrose, vice president and general manager of communications networks, RadiSys. “The proven ATCA form factor is serving the industry well, but many TEMs require an architecture with lower compute density and reduced power requirements. Certainly not meant to replace ATCA, but instead complement it, MicroTCA in many cases is a more appropriate approach for access-side telecom nodes such as WiMAX base stations, digital subscriber line access multiplexers (DSLAMs) and low-end media gateways.”
CorEdge Networks will supply its industry leading MicroTCA and PicoTCA infrastructure components that will complement AMCs from RadiSys. Specifically, CorEdge will supply its MicroTCA Carrier Hub (MCH), MicroTCA Power Module and PicoTCA 2UE chassis platform. The MicroTCA Carrier Hub is a single chip solution that enables integrated management and switching. The MCH’s modular and upgradeable multi-module design permits developers to add a variety of different clocking schemes (GPS, telco and PCI-Express) and fabric modules (10GbE, SerialRapidIO and PCI-Express) to enable multiple applications.
“Our collaboration with RadiSys represents an exciting step for telecommunications equipment manufacturers and system architects,” said William Chu, President and Chief Marketing Officer, CorEdge Networks. “An affordable, efficient and scalable platform from CorEdge coupled with the proven track record that RadiSys brings to the table clearly provides a winning combination for developing applications.”
Arrow NAC will handle fulfillment and integration of the development kit. TEMs can order RadiSys MicroTCA products through Arrow NAC – a leading provider of semiconductors and passive, electromechanical and connector products, computing solutions, services and supply chain solutions.
“We are excited about this opportunity to partner with RadiSys and CorEdge and leverage Arrow’s extensive supply chain and integration capabilities. This collaborative approach will enable OEMS to easily adopt the MicroTCA standard while reducing time and improving cost to market,” said Robert Behn, Vice President, Marketing, Arrow NAC.
The SYS-3005DK MicroTCA Development Kit includes a MicroTCA chassis with power module and a base MCH with options to extend fabric options. The development kit comes integrated with three RadiSys AMCs – AMC-8202 (MPC8641D PrAMC), AMC-7211 (Cavium OCTEON based Gigabit line AMC) and AMC-3202 (SAS Hard Disk AMC). These AMCs enable customers to develop key applications for multi-service access applications based on Ethernet. The development kit also includes software such as carrier grade OS and other data path software for IP Forwarding, IP Sec, IP Filtering and Load Balancing. The complete development kit enhances a customer’s ability to address new applications in a variety of target markets including Edge/Access, Aero/Military and Campus Networks infrastructures.
About CorEdge Networks
CorEdge Networks is a leading supplier of MicroTCA compliant infrastructure products including the industry’s first MicroTCA Carrier Hub (MCH), 10GbE MCH, MicroTCA Power Module, PicoTCA development platform and, 10Gbps and 20Gbps FPGA-based AMCs. CorEdge Networks customers include a number of leading telecom, military and embedded systems companies. Most MicroTCA working deployments use one or more CorEdge Networks components.
RadiSys (Nasdaq: RSYS) is a leading provider of advanced solutions for the communications networking and commercial systems markets. Through intimate customer collaboration and combining innovative technologies and industry leading architecture, RadiSys helps OEMs, systems integrators and solution providers bring better products to market faster and more economically. RadiSys products include embedded boards, application enabling platforms and turn-key systems, which are used in today’s complex computing, processing and network intensive applications.